1SG040HH1F35E2LG

The 1SG040HH1F35E2LG is a Stratix® 10 GX field programmable gate array (FPGA) manufactured by Intel, supplied in a 1152-BBGA (FCBGA) package. It is a high-capacity FPGA device intended for applications requiring significant programmable logic, on-chip memory, and a large number of I/O connections.

With 378,000 logic elements, 31,457,280 total RAM bits, and 374 I/O pins, this device is positioned to consolidate complex digital functions on a single surface-mount FPGA. Key device attributes include a 1152-FBGA (35×35) package, a core voltage supply range of 820 mV to 880 mV, and an operating temperature range of 0 °C to 100 °C (Extended grade).

Key Features

• Core Logic 378,000 logic elements for implementing large-scale programmable logic and complex digital designs.
• On-chip Memory 31,457,280 total RAM bits to support buffering, state storage, and memory-intensive logic functions.
• I/O Resources 374 I/O pins to enable extensive board-level interfacing and connectivity.
• Power Voltage supply range of 820 mV to 880 mV for the device core.
• Package and Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for compact board integration.
• Operating Range and Grade Operating temperature 0 °C to 100 °C and Extended grade for broader deployment conditions.
• Environmental RoHS compliant.

Typical Applications

• Custom digital hardware acceleration — Implement high-density programmable accelerators using the device's large logic element array and on-chip RAM.
• High-density I/O bridging and protocol conversion — Leverage 374 I/O pins to route and convert multiple interfaces on a single FPGA.
• Platform development and prototyping — Use the 1152-FBGA package and extensive resources for board-level evaluation and system integration.

Unique Advantages

• High logic capacity: 378,000 logic elements allow consolidation of multiple functions into one device, reducing component count.
• Substantial on-chip memory: 31,457,280 RAM bits provide local storage for buffering and state machines, reducing dependence on external memory.
• Extensive I/O: 374 I/O pins support complex connectivity and flexible board routing options.
• Compact FCBGA package: 1152-FBGA (35×35) surface-mount package supports high-density PCB implementations.
• Defined core-voltage window: 820–880 mV supply range gives clear parameters for power-supply design.
• Extended temperature grade: 0 °C to 100 °C operating range for deployment across a range of environmental conditions.

Why Choose 1SG040HH1F35E2LG?

The 1SG040HH1F35E2LG Stratix® 10 GX FPGA combines high logic density, substantial on-chip RAM, and a large I/O complement in a compact 1152-FBGA package. These attributes make it well suited for designs that require consolidation of complex digital functions, significant buffering or memory resources, and flexible board-level interfacing.

Manufactured by Intel and offered in an Extended temperature grade with RoHS compliance, this device is a practical option for engineering teams focused on high-capacity FPGA implementations where board space, I/O count, and on-chip memory are primary design drivers.

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