1SD280PT3F55I3VGS1

The 1SD280PT3F55I3VGS1 is an Intel Stratix® 10 DX Field Programmable Gate Array supplied in a 2912‑BBGA FCBGA package. It targets high‑performance acceleration and I/O‑intensive applications with a high logic capacity, large embedded RAM, and extensive I/O resources.

Built on the Stratix 10 DX family architecture, this device supports advanced on‑die and package integration options and hard IP blocks for modern datacenter, networking, cloud computing, and test & measurement use cases where high bandwidth, low latency interfaces and large programmable logic are required.

Key Features

• High logic capacity — 2,753,000 logic elements (cells) for large, complex programmable designs.
• Large on‑chip memory — 240,123,904 total RAM bits to support buffering, packet processing, and large lookup tables.
• Extensive I/O — 816 user I/O pins suitable for high‑density interfacing and parallel connectivity.
• Advanced family architecture — Stratix 10 DX series features including the Intel Hyperflex core architecture and a 14 nm tri‑gate (FinFET) fabric as described in the device family overview.
• High‑speed transceiver capability (series feature) — Stratix 10 DX family transceivers support PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps for demanding serial links (series‑level capability documented in the device overview).
• Hard IP and protocol support (series feature) — Family overview documents hard PCIe Gen4 x16 IP, 100 GbE blocks, and DDR4 memory control available within the Stratix 10 DX series.
• Package and mounting — 2912‑BBGA FCBGA package (supplier package: 2912‑FBGA, 55 × 55) designed for surface mount assembly.
• Power and thermal — Core voltage range 870 mV to 970 mV; operating temperature −40 °C to 100 °C for industrial environments.
• Security and configuration (series feature) — Device overview references configuration management and secure device manager (SDM) and device security capabilities within the Stratix 10 DX family.
• Compliance — RoHS‑compliant supply status.

Typical Applications

• Datacenter acceleration — Large logic capacity and family support for coherent and non‑coherent interfaces make this device suitable for FPGA‑based accelerators in compute and storage applications.
• High‑speed networking — Series transceiver and hard IP capabilities (100 GbE, PCIe Gen4) support line‑rate packet processing, switching, and network function offload.
• Cloud computing — Use in cloud infrastructure for workload acceleration and high‑bandwidth memory attachment options described for the Stratix 10 DX family.
• Test & measurement — Large RAM and high I/O count enable complex instrument control, real‑time signal processing, and data capture at high throughput.

Unique Advantages

• Massive programmable fabric: 2,753,000 logic elements allow mapping of large, timing‑critical designs without partitioning across multiple devices.
• Substantial embedded memory: 240,123,904 total RAM bits provide on‑chip capacity for buffering, state tables, and large working sets.
• High I/O density: 816 I/O pins support wide parallel interfaces and mixed‑signal board designs requiring many endpoints.
• Industrial temperature range: −40 °C to 100 °C rating addresses designs deployed in industrial environments.
• High‑density packaging: 2912‑BBGA / 2912‑FBGA (55 × 55) package supports a compact footprint while providing large ball counts for routing and power delivery.
• Series‑level high‑speed interface support: The Stratix 10 DX family offers high‑speed transceivers and hardened protocol IP to simplify integration of PCIe Gen4, 100 GbE, and other high‑bandwidth links.

Why Choose 1SD280PT3F55I3VGS1?

The 1SD280PT3F55I3VGS1 delivers a combination of very high logic density, significant on‑chip RAM, and broad I/O resources in an industrial‑rated Stratix 10 DX device package. It is positioned for designs that require substantial programmable resources alongside family features such as advanced core architecture, high‑speed serial links, and hardened protocol IP documented for the Stratix 10 DX family.

This part is suited to system architects and engineers building acceleration, networking, cloud, and test & measurement solutions that demand scalability, integration of high‑bandwidth interfaces, and robust thermal and voltage operating windows.

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