1SD280PT3F55E3VG

The 1SD280PT3F55E3VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) offered in a 2912-BBGA FCBGA package with a 55×55 mm supplier device footprint. It delivers high logic density and on-chip memory alongside family-level capabilities such as Intel Hyperflex core architecture, hardened interface IP, and advanced packaging options to address demanding acceleration and networking use cases.

Targeted at high-performance acceleration, datacenter, networking, cloud computing, and test & measurement applications, this extended-grade, surface-mount FPGA combines millions of logic cells, extensive RAM, and a large I/O count with power and thermal operating ranges suitable for many server and systems environments.

Key Features

• Logic Capacity  Provides 2,753,000 logic elements (cells) for large-scale, complex logic implementations.
• On-chip Memory  Includes 240,123,904 total RAM bits for buffering, packet processing, and large state storage.
• I/O Density  Up to 816 I/O pins to support wide external connectivity and multiple memory or peripheral interfaces.
• Package & Mounting  2912-BBGA FCBGA package (supplier device package: 2912-FBGA 55×55) designed for surface-mount assembly.
• Power and Thermal  Core supply operating range specified from 870 mV to 970 mV with device operating temperature range 0 °C to 100 °C.
• Family-level Architecture  Built on the Intel Stratix 10 DX platform featuring the Intel Hyperflex core architecture, hardened IP for coherent/non-coherent protocols, and support elements such as DSP blocks and memory controllers described in the device overview.
• High-speed Interfaces  Stratix 10 DX family transceiver tiles and hard IP support high data-rate serial interfaces and PCIe Gen4 hard IP as described in the device overview.
• Extended Grade & Compliance  Extended-grade device with RoHS compliance for regulatory conformance.

Typical Applications

• Datacenter Acceleration  Hardware acceleration for compute workloads where high logic density and large on-chip RAM are required.
• Networking & Telecom  High-speed packet processing and protocol offload using abundant I/O and family-level high-speed transceiver capabilities.
• Cloud Computing  Custom data-path and interface implementations leveraging the device’s logic capacity and hardened IP options.
• Test & Measurement  High-channel-count signal processing and real-time analysis enabled by large RAM and DSP resources described for the Stratix 10 DX family.

Unique Advantages

• Large Logic & Memory Footprint:  2,753,000 logic elements and 240,123,904 RAM bits support complex algorithms and deep buffering on a single device.
• High I/O Count:  816 I/Os enable broad external interfacing without sacrificing internal resources.
• Family Architecture Benefits:  Stratix 10 DX family innovations such as the Intel Hyperflex architecture and hardened interface IP provide design options for coherent/non‑coherent protocols and high-speed connectivity.
• Advanced Packaging:  2912-FBGA (55×55) package supports dense integration for system-level designs that require a high-pin-count, surface-mount FPGA.
• Operational Range:  Specified core voltage window (870 mV–970 mV) and 0 °C–100 °C operating range align with many server and systems environments.

Why Choose 1SD280PT3F55E3VG?

The 1SD280PT3F55E3VG positions itself as a high-capacity Stratix 10 DX FPGA option for system designers who need substantial logic, on-chip RAM, and a large I/O complement in a single surface-mount package. Backed by the Stratix 10 DX device architecture and family-level features, it is suitable for complex acceleration, networking, and measurement applications that require scalable logic and integrated hardened IP options.

For teams building high-performance systems, this device delivers the deterministic resource counts and package-level details necessary for board-level integration and procurement while remaining compliant with RoHS requirements.

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