1SD280PT2F55I1VG
| Part Description |
Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 1,340 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 816 | Voltage | 870 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 2753000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SD280PT2F55I1VG – Stratix® 10 DX Field Programmable Gate Array (FPGA), 2912-BBGA FCBGA
The 1SD280PT2F55I1VG is an Intel Stratix® 10 DX FPGA in a 2912-BBGA (2912-FBGA, 55×55) surface-mount package, offered for industrial-grade applications. It combines a high-performance FPGA fabric based on the Intel Hyperflex core architecture with large on-chip memory and extensive I/O to address compute- and data-intensive system designs in datacenter, networking, cloud computing, and test & measurement markets.
Designed for high-throughput and integrated system implementations, this device provides millions of logic elements, hundreds of megabits of on-chip RAM, and a broad I/O complement, while supporting low-voltage core operation and an extended industrial temperature range.
Key Features
- Logic Capacity — 2,753,000 logic element cells, enabling complex FPGA designs and large-scale hardware acceleration.
- On-chip Memory — 240,123,904 total RAM bits for large buffer and state storage directly in the FPGA fabric.
- I/O Density — 816 user I/O pins to support extensive external interfacing and heterogeneous system connectivity.
- High-performance Fabric — Intel Hyperflex core architecture and 14 nm FinFET process (family-level detail) for higher core performance in compute-critical designs.
- Advanced Transceivers & Interfaces — Family documentation cites transceiver capabilities up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ, plus hard IP blocks for PCIe Gen4 x16 and 100 Gigabit Ethernet (series-level features).
- Memory and Processing Options (series) — Select Stratix 10 DX devices include integrated HBM2 memory and/or an embedded quad-core Arm Cortex‑A53 HPS (family-level options).
- Package & Mounting — 2912-BBGA (2912-FBGA, 55×55) package; surface-mount device for board-level assembly.
- Power and Thermal — Core voltage supply range 870 mV to 970 mV; operating temperature range −40 °C to 100 °C suitable for industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- Datacenter Acceleration — Implement hardware acceleration and packet processing functions where large logic capacity and high on-chip memory reduce latency and offload servers.
- High-speed Networking — Leverage the device’s extensive I/O and family-level transceiver/IP capabilities for 100 GbE, PCIe Gen4 interconnects, and high-throughput switch/router designs.
- Cloud & Edge Compute — Use large logic resources and memory to deploy customizable processing pipelines and inline data transformation at cloud and edge nodes.
- Test & Measurement — Build precision, high-channel-count instrumentation and real-time signal processing systems that require dense logic and substantial on-chip RAM.
Unique Advantages
- Massive Logic and Memory in One Device: 2.75M logic elements and 240M RAM bits allow complex algorithms and large datasets to be implemented on-chip, reducing external memory dependence.
- High I/O Count: 816 I/O pins support dense external connectivity and flexible board-level partitioning for multi-protocol systems.
- Industrial Temperature Rating: −40 °C to 100 °C operation meets extended-environment requirements for industrial deployments.
- Low-voltage Core Operation: 870–970 mV supply range aligns with modern power architectures for efficient core power delivery.
- Advanced Packaging: 2912-BBGA (55×55) surface-mount package supports high-bandwidth board routing and thermal/space-efficient system designs.
- Family-level System Integration: Stratix 10 DX family features such as Hyperflex architecture, EMIB packaging, HBM2 and HPS options, and high-speed transceivers provide roadmap scalability and system-level capabilities.
Why Choose 1SD280PT2F55I1VG?
The 1SD280PT2F55I1VG delivers a combination of large logic capacity, abundant on-chip RAM, and high I/O density in a robust industrial-grade package. It is positioned for system designs that demand substantial programmable compute, real-time processing, and high-bandwidth interfacing—particularly in datacenter, networking, cloud, and test & measurement applications.
Choosing this Stratix 10 DX device provides a scalable platform within the Stratix 10 DX family, enabling designers to leverage family-level features such as advanced fabric architecture, high-speed transceivers, and optional integrated memory/processor capabilities while maintaining industrial temperature operation and RoHS compliance.
Request a quote or submit a product inquiry to get pricing and availability for 1SD280PT2F55I1VG and to discuss how it can fit your next high-performance FPGA design.

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