1SD280PT2F55I1VG

IC FPGA 816 I/O 2912FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA

Quantity 1,340 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O816Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2753000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SD280PT2F55I1VG – Stratix® 10 DX Field Programmable Gate Array (FPGA), 2912-BBGA FCBGA

The 1SD280PT2F55I1VG is an Intel Stratix® 10 DX FPGA in a 2912-BBGA (2912-FBGA, 55×55) surface-mount package, offered for industrial-grade applications. It combines a high-performance FPGA fabric based on the Intel Hyperflex core architecture with large on-chip memory and extensive I/O to address compute- and data-intensive system designs in datacenter, networking, cloud computing, and test & measurement markets.

Designed for high-throughput and integrated system implementations, this device provides millions of logic elements, hundreds of megabits of on-chip RAM, and a broad I/O complement, while supporting low-voltage core operation and an extended industrial temperature range.

Key Features

  • Logic Capacity — 2,753,000 logic element cells, enabling complex FPGA designs and large-scale hardware acceleration.
  • On-chip Memory — 240,123,904 total RAM bits for large buffer and state storage directly in the FPGA fabric.
  • I/O Density — 816 user I/O pins to support extensive external interfacing and heterogeneous system connectivity.
  • High-performance Fabric — Intel Hyperflex core architecture and 14 nm FinFET process (family-level detail) for higher core performance in compute-critical designs.
  • Advanced Transceivers & Interfaces — Family documentation cites transceiver capabilities up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ, plus hard IP blocks for PCIe Gen4 x16 and 100 Gigabit Ethernet (series-level features).
  • Memory and Processing Options (series) — Select Stratix 10 DX devices include integrated HBM2 memory and/or an embedded quad-core Arm Cortex‑A53 HPS (family-level options).
  • Package & Mounting — 2912-BBGA (2912-FBGA, 55×55) package; surface-mount device for board-level assembly.
  • Power and Thermal — Core voltage supply range 870 mV to 970 mV; operating temperature range −40 °C to 100 °C suitable for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Datacenter Acceleration — Implement hardware acceleration and packet processing functions where large logic capacity and high on-chip memory reduce latency and offload servers.
  • High-speed Networking — Leverage the device’s extensive I/O and family-level transceiver/IP capabilities for 100 GbE, PCIe Gen4 interconnects, and high-throughput switch/router designs.
  • Cloud & Edge Compute — Use large logic resources and memory to deploy customizable processing pipelines and inline data transformation at cloud and edge nodes.
  • Test & Measurement — Build precision, high-channel-count instrumentation and real-time signal processing systems that require dense logic and substantial on-chip RAM.

Unique Advantages

  • Massive Logic and Memory in One Device: 2.75M logic elements and 240M RAM bits allow complex algorithms and large datasets to be implemented on-chip, reducing external memory dependence.
  • High I/O Count: 816 I/O pins support dense external connectivity and flexible board-level partitioning for multi-protocol systems.
  • Industrial Temperature Rating: −40 °C to 100 °C operation meets extended-environment requirements for industrial deployments.
  • Low-voltage Core Operation: 870–970 mV supply range aligns with modern power architectures for efficient core power delivery.
  • Advanced Packaging: 2912-BBGA (55×55) surface-mount package supports high-bandwidth board routing and thermal/space-efficient system designs.
  • Family-level System Integration: Stratix 10 DX family features such as Hyperflex architecture, EMIB packaging, HBM2 and HPS options, and high-speed transceivers provide roadmap scalability and system-level capabilities.

Why Choose 1SD280PT2F55I1VG?

The 1SD280PT2F55I1VG delivers a combination of large logic capacity, abundant on-chip RAM, and high I/O density in a robust industrial-grade package. It is positioned for system designs that demand substantial programmable compute, real-time processing, and high-bandwidth interfacing—particularly in datacenter, networking, cloud, and test & measurement applications.

Choosing this Stratix 10 DX device provides a scalable platform within the Stratix 10 DX family, enabling designers to leverage family-level features such as advanced fabric architecture, high-speed transceivers, and optional integrated memory/processor capabilities while maintaining industrial temperature operation and RoHS compliance.

Request a quote or submit a product inquiry to get pricing and availability for 1SD280PT2F55I1VG and to discuss how it can fit your next high-performance FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up