1SD280PT2F55E1VGS2

The 1SD280PT2F55E1VGS2 is an Intel Stratix® 10 DX field-programmable gate array presented in a 2912-ball FBGA (55×55 mm) package. It delivers very high logic capacity, extensive on-chip memory, and a large I/O count intended for high-performance acceleration use cases.

Stratix 10 DX devices are built around the Intel Hyperflex core architecture and advanced EMIB packaging, and are targeted at applications such as datacenter acceleration, networking, cloud computing, and test & measurement where performance, integration and high‑speed I/O matter.

Key Features

• Logic Capacity — 2,753,000 logic elements (cells) to implement large, complex digital designs.
• On-chip Memory — 240,123,904 total RAM bits for buffering, lookup tables and state storage.
• I/O Density — 816 I/O pins for broad external connectivity and multi-channel interfacing.
• Package & Mounting — 2912-BBGA (FBGA) 55×55 mm supplier package; surface-mount mounting type for board-level assembly.
• Operating Range — Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Core Voltage — Core supply specified at 870 mV to 970 mV.
• High‑Performance Architecture (Family) — Stratix 10 DX family features the Intel Hyperflex core architecture, EMIB packaging, and variable-precision DSP blocks to support demanding compute tasks.
• High‑Speed I/O & IP (Family) — Stratix 10 DX devices include hardened IP such as PCIe Gen4 x16 and transceiver support with data rates referenced up to 57.8 Gbps (PAM4) and 28.9 Gbps (NRZ) for high-bandwidth links.
• Advanced Memory Options (Family) — The Stratix 10 DX family supports technologies such as heterogeneous 3D-stacked HBM2 and DDR‑T controllers designed to attach persistent memory modules in select device options.

Typical Applications

• Datacenter Acceleration — Implement hardware acceleration for networking, compression, encryption, or custom compute offloads using large logic and memory resources.
• High‑Performance Networking — Use the device’s high I/O count and family transceiver capabilities to build high-throughput switching, routing, and packet-processing systems.
• Cloud & Hyperscale Infrastructure — Deploy in cloud infrastructure designs that require scalable FPGA resources and advanced fabric integration.
• Test & Measurement — Drive complex signal processing, protocol analyzers, and instrumentation that leverage the device’s logic density and on-chip RAM.

Unique Advantages

• Very high logic density: 2,753,000 logic elements enable large-scale hardware implementations without external logic partitioning.
• Significant on-chip memory: 240,123,904 RAM bits provide substantial local storage for buffering and stateful processing, reducing external memory dependence.
• Extensive external connectivity: 816 I/Os support complex multi-interface designs and dense board-level connectivity.
• Advanced family-level IP: Stratix 10 DX family includes hardened PCIe Gen4 x16 and high-speed transceivers to simplify high-bandwidth system design.
• Compact high-ball-count package: 2912-ball FBGA (55×55 mm) balances footprint and I/O density for system integration.
• Extended-grade and compliance: Rated for 0 °C to 100 °C operation and RoHS compliant for deployment in extended-temperature commercial environments.

Why Choose 1SD280PT2F55E1VGS2?

The 1SD280PT2F55E1VGS2 combines very large logic capacity, substantial on-chip RAM, and a high I/O count in a high‑ball‑count FBGA package—making it suitable for designers targeting demanding compute and I/O-intensive applications. As part of the Intel Stratix 10 DX family, it benefits from the family’s Hyperflex architecture and advanced packaging innovations.

This device is positioned for teams building high-throughput networking, datacenter acceleration, and advanced test systems that require scalable FPGA resources and the option to leverage Stratix 10 DX family IP for high-speed interfaces and memory architectures.

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