1SD280PT2F55E2VGS1

IC FPGA 816 I/O 2912FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA

Quantity 694 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package2912-FBGA (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O816Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2753000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SD280PT2F55E2VGS1 – Stratix® 10 DX FPGA, 2,753,000 logic elements

The 1SD280PT2F55E2VGS1 is an Intel Stratix® 10 DX field-programmable gate array (FPGA) supplied in a 2912-BBGA flip-chip package. It combines a high-capacity programmable fabric with Stratix 10 DX family features such as the Intel Hyperflex core architecture and a range of integrated hard intellectual-property blocks for compute and high-bandwidth I/O.

Designed for high-performance acceleration in markets such as datacenter, networking, cloud computing and test & measurement, this device delivers large logic and memory resources, extensive I/O, and advanced transceiver and interface capabilities suitable for demanding system designs.

Key Features

  • Core & Architecture  Intel Stratix 10 DX family architecture with Intel Hyperflex core technology as described for the Stratix 10 DX device series.
  • Logic Capacity  2,753,000 logic elements (cells) for implementing large, complex designs.
  • Internal Memory  240,123,904 total RAM bits providing significant on-chip storage for buffers, FIFOs and design state.
  • I/O Density  816 user I/O pins to support broad connectivity and multiple external interfaces.
  • High-Speed Transceivers & Hard IP  Stratix 10 DX family devices include heterogeneous transceiver tiles and hard IP for protocols such as PCIe Gen4 and 100 GbE; the family supports high-speed serial signaling for demanding link applications.
  • Memory & External Interfaces  Series features include DDR4 memory controllers and a DDR‑T soft IP controller option for attaching persistent memory; select devices in the family may include HBM2 stacked DRAM.
  • Package & Mounting  2912-BBGA (2912-FBGA 55×55) flip-chip BGA, surface-mount mounting type for high-density board designs.
  • Power & Supply  Specified core voltage supply range of 870 mV to 970 mV.
  • Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Datacenter Acceleration  Hardware acceleration, protocol offload and custom compute kernels where large logic capacity and high-bandwidth I/O reduce latency and increase throughput.
  • High-Speed Networking  Packet processing, line-rate encryption/decryption, and networking appliances leveraging integrated hard IP for 100 GbE and high-speed transceivers.
  • Cloud & Infrastructure  Compute and I/O aggregation functions, including PCIe Gen4 connectivity for high-throughput host interfaces.
  • Test & Measurement  Real-time signal processing and capture systems that require extensive on-chip memory and large programmable logic resources.

Unique Advantages

  • Large, Scalable Logic Resource: 2,753,000 logic elements enable complex implementions without partitioning across multiple devices.
  • Substantial On-Chip Memory: 240,123,904 bits of RAM provide capacity for buffering, packet storage and algorithm state close to the logic fabric.
  • Extensive I/O Count: 816 I/Os allow flexible interfacing to a wide range of peripherals, memory, and module connectors.
  • Family-Level High-Speed Interfaces: Stratix 10 DX family hard IP for PCIe Gen4, 100 GbE, and advanced transceiver technology simplifies integration of high-bandwidth links.
  • Advanced Packaging: 2912-BBGA flip-chip package (55×55) supports dense routing and thermal performance for high-pin-count designs.
  • Documented Platform: Features and architecture details are provided in the Stratix 10 DX device documentation to support design planning and integration.

Why Choose 1SD280PT2F55E2VGS1?

The 1SD280PT2F55E2VGS1 positions itself as a high-capacity Stratix 10 DX family FPGA for system designs that require extensive programmable logic, large on-chip memory, and significant I/O resources. Its specification set — including 2,753,000 logic elements, 240,123,904 RAM bits, and 816 I/Os — supports complex algorithms, large data buffering and multi-protocol interfacing within a single device.

This device is suitable for engineering teams developing datacenter acceleration, high-speed networking, cloud infrastructure, and test & measurement equipment who need a scalable, well-documented FPGA platform with family-level connectivity and high-speed interface options. The extended-grade temperature range and RoHS compliance make it appropriate for many demanding commercial deployments.

Request a quote or contact sales to discuss pricing, availability and how the 1SD280PT2F55E2VGS1 can fit into your next high-performance FPGA design.

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