1SD280PT2F55E1VGS1

IC FPGA 816 I/O 2912FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA

Quantity 207 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package2912-FBGA (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O816Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2753000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SD280PT2F55E1VGS1 – Stratix® 10 DX Field Programmable Gate Array (FPGA), 2912-FBGA (55×55)

The 1SD280PT2F55E1VGS1 is an Intel Stratix 10 DX family FPGA device in a 2912‑FBGA (55×55) surface‑mount package. It delivers large programmable logic capacity, extensive on‑chip RAM, and a high I/O count suitable for demanding acceleration and high‑bandwidth designs.

As part of the Stratix 10 DX family, this device benefits from family‑level architectural innovations such as the Intel Hyperflex core architecture and advanced packaging options described for Stratix 10 DX devices. Target markets for devices in this family include datacenter acceleration, networking, cloud computing, and test & measurement.

Key Features

  • Logic Capacity  2,753,000 logic elements (cells) for large, complex logic implementations and high gate-count designs.
  • On‑Chip Memory  240,123,904 total RAM bits to support deep buffering, packet processing, and data‑intensive algorithms.
  • I/O Density  816 I/O pins to support extensive external connectivity and high‑pin‑count interfaces.
  • Power and Voltage  Core voltage supply range 870 mV to 970 mV to match system power rails and regulator designs.
  • Package & Mounting  2912‑BBGA / FCBGA package (supplier package: 2912‑FBGA, 55×55) with surface‑mount mounting type for high‑density board integration.
  • Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for demanding thermal environments outside standard consumer ranges.
  • Compliance  RoHS compliant for adherence to common environmental and material restrictions.
  • Stratix 10 DX Family Capabilities  Family‑level features include the Intel Hyperflex core architecture, heterogeneous transceiver tiles, hard IP for protocols such as PCIe Gen4 and 100 GbE, and advanced EMIB‑based packaging technologies.
  • Advanced Memory & Interface Options (Family‑Level)  The Stratix 10 DX family documentation describes support for DDR‑T controllers and options to attach persistent memory modules; select family devices provide additional embedded options such as HBM2 or a hard processor subsystem.

Typical Applications

  • Datacenter Acceleration  High logic capacity and large on‑chip RAM make this device suitable for FPGA‑based accelerators handling compute‑intensive workloads.
  • Networking & Switching  The combination of high I/O count and family‑level hard IP for high‑speed interfaces supports packet processing, line‑rate engines, and custom switching functions.
  • Cloud Computing Infrastructure  Use in cloud offload and virtualized I/O scenarios where programmable logic and large memory buffers enable flexible workload acceleration.
  • Test & Measurement  Large logic and memory resources support complex real‑time measurement, signal processing, and protocol analysis applications.

Unique Advantages

  • High integration density: 2.75 million logic elements and over 240 million RAM bits reduce the need for external logic and memory in large designs.
  • Extensive external connectivity: 816 I/O pins enable complex multi‑channel interfaces and high‑pin‑count subsystem integration.
  • Deployment flexibility: Extended grade and a 0 °C to 100 °C operating range support a wide set of thermal environments common in datacenter and communications equipment.
  • Family architectural benefits: Stratix 10 DX family innovations (Hyperflex core architecture, heterogeneous transceivers, hard PCIe/100GbE IP) provide proven building blocks for high‑performance designs.
  • Board‑level convenience: Surface‑mount 2912‑FBGA (55×55) package supports compact, high‑density PCB layouts.
  • Regulatory readiness: RoHS compliance simplifies material compliance for global deployments.

Why Choose 1SD280PT2F55E1VGS1?

The 1SD280PT2F55E1VGS1 positions itself for systems that require very high programmable logic capacity, substantial on‑chip memory, and a large number of I/Os in a compact, surface‑mount FBGA package. It is well suited to engineering teams designing acceleration, networking, and measurement platforms that leverage Stratix 10 DX family architecture and hard IP options.

Choosing this device provides a scalable on‑chip resource set for complex algorithms and high‑bandwidth data flows while maintaining materials compliance and an extended operating temperature range for robust system integration.

Request a quote or submit a procurement inquiry for part number 1SD280PT2F55E1VGS1 to get pricing and availability information for your project.

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