1SD280PT2F55E2VGS2

The 1SD280PT2F55E2VGS2 is an Intel Stratix® 10 DX field programmable gate array supplied in a 2912-BBGA FCBGA (55×55) package for surface-mount applications. As a member of the Stratix 10 DX family, these devices target high-performance acceleration applications in datacenter, networking, cloud computing, and test & measurement markets.

This device combines a monolithic 14 nm FPGA fabric with advanced packaging and series-level capabilities such as the Intel Hyperflex core architecture, high-speed transceiver and hard-IP support for high-bandwidth protocols, and memory/interface options described in the Stratix 10 DX documentation.

Key Features

• Logic Capacity — 2,753,000 logic elements (cells) to implement large, complex FPGA designs and parallelized hardware acceleration.
• On‑Chip Memory — 240,123,904 total RAM bits for buffering, on-chip datasets, and high-throughput signal processing.
• I/O Density — 816 user I/O pins to support broad external connectivity and multi-channel interfaces.
• Advanced Core Architecture — Intel Hyperflex core architecture and a 14 nm tri‑gate (FinFET) process as described for Stratix 10 DX devices, delivering the series' architectural performance improvements.
• High‑Speed Interfaces (Series‑Level) — Stratix 10 DX devices include hard IP for high-speed protocols such as PCIe Gen4 x16 and 100 Gigabit Ethernet, plus transceivers capable of up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ as documented for the series.
• Memory & Expansion (Series‑Level) — Series documentation describes DDR‑T soft IP for attaching persistent Intel Optane PMem and options for embedded HBM2 in select devices.
• Package & Mounting — 2912-FBGA (55×55) supplier device package; surface-mount mounting type suitable for high-density PCB designs.
• Power — Supported core voltage supply range from 870 mV to 970 mV for device operation.
• Operating Range — Rated for 0 °C to 100 °C operation and supplied in an Extended grade.
• Compliance — RoHS compliant.

Typical Applications

• Datacenter Acceleration — Implement hardware accelerators and custom data-paths leveraging the device’s large logic capacity and on-chip memory for compute-intensive workloads.
• High‑Speed Networking — Use the series’ hard IP for 100 Gigabit Ethernet and high-speed transceivers to implement line-rate packet processing and switching functions.
• Cloud and Edge Compute — Deploy adaptable FPGA-based workloads that require dense logic, significant RAM bits, and flexible I/O for cloud and edge offload tasks.
• Test & Measurement — Build high-bandwidth acquisition, real-time processing, and protocol emulation systems that leverage the device’s logic resources and I/O density.

Unique Advantages

• High Logic & Memory Density: 2,753,000 logic elements paired with 240,123,904 RAM bits enable complex algorithms and large working datasets on-chip, reducing external memory dependence.
• Broad I/O Capability: 816 I/O pins support numerous parallel interfaces and multi-lane high-speed links for flexible system integration.
• Series‑Level High‑Speed IP: Stratix 10 DX documentation details hardened PCIe Gen4 and high-speed transceiver support, simplifying implementation of industry-standard interfaces.
• Robust Packaging for Dense Designs: 2912-BBGA (55×55) FCBGA package allows high pin-count surface-mount deployment in space-constrained PCBs.
• Predictable Power Window: Specified core voltage range (870 mV–970 mV) supports controlled power provisioning for system power budgeting.
• Extended Grade & RoHS Compliance: Delivered in an Extended grade with RoHS compliance to meet common commercial and industrial deployment requirements.

Why Choose 1SD280PT2F55E2VGS2?

The 1SD280PT2F55E2VGS2 provides a high-capacity Stratix 10 DX FPGA option in a 2912-BBGA package, combining millions of logic elements, hundreds of megabits of on-chip RAM, and hundreds of I/O pins for demanding acceleration and networking designs. Its series-level architectural features—such as the Intel Hyperflex core, advanced packaging, and documented high-speed hard IP—make it suitable for developers needing scalable performance and dense integration.

This device is well suited to engineering teams building datacenter accelerators, high-throughput network equipment, cloud offload modules, and precision test systems where large FPGA capacity, substantial on-chip memory, and extensive I/O are required. The Extended grade, specified operating range, and RoHS compliance support reliable deployment in commercial and industrial environments.

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