1SD280PT2F55I1VGS1

IC FPGA 816 I/O 2912FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA

Quantity 975 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package2912-FBGA (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O816Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2753000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SD280PT2F55I1VGS1 – Stratix® 10 DX Field Programmable Gate Array (FPGA) IC

The 1SD280PT2F55I1VGS1 is an Intel Stratix® 10 DX FPGA provided in a 2912-BBGA FCBGA package (supplier package: 2912-FBGA, 55×55). It delivers a high-density, industrial-grade programmable fabric tailored for compute- and I/O-intensive designs.

Built on the Stratix 10 DX family architecture, this device targets datacenter, networking, cloud computing and test & measurement applications by combining large logic capacity, extensive on-chip RAM, and high-speed transceiver and protocol support described for the DX series.

Key Features

  • Logic Capacity  Provides 2,753,000 logic element cells for complex programmable logic and custom acceleration tasks.
  • On-Chip Memory  Includes 240,123,904 total RAM bits to support large buffering, on-chip data structures, and high-throughput pipelines.
  • I/O Density  Offers 816 user I/O pins to support wide external interfacing and high port counts in compact board designs.
  • Stratix 10 DX Architecture  Part of the Stratix 10 DX family which features the Intel Hyperflex core architecture, variable precision DSP blocks, and family-level hard IP such as PCIe Gen4 and 100 GbE (as described in the Stratix 10 DX overview).
  • High-Speed Transceivers (family-level)  The Stratix 10 DX family documentation indicates heterogeneous transceiver tiles supporting up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ signaling for high-bandwidth serial links.
  • Memory & IP Integration (family-level)  DX-series devices support advanced memory and IP options including HBM2 and hard DDR4/PCIe IP blocks, plus DDR-T soft IP for direct attachment of persistent memory modules (per family datasheet).
  • Package & Mounting  Surface-mount device in a 2912-BBGA FCBGA package; supplier package listed as 2912-FBGA (55×55).
  • Supply & Temperature  Specified core supply range 870 mV to 970 mV and industrial operating temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Datacenter Acceleration  Use for compute acceleration and custom offload engines where high logic density and on-chip memory accelerate data-path processing.
  • High‑Performance Networking  Deploy in switches, routers, and line cards that require large I/O counts and support for high-speed serial transceivers and hardened protocol IP (as provided by the Stratix 10 DX family).
  • Cloud & Storage Interfaces  Implement controllers and protocol bridges that leverage the device’s memory capacity and family-level PCIe/DDR IP to connect to high-throughput storage and persistent memory subsystems.
  • Test & Measurement Systems  Integrate into instrumentation that demands deterministic logic, large on-chip RAM for capture/analysis, and wide external I/O.

Unique Advantages

  • High Logic Density:  2,753,000 logic element cells enable complex, high-parallelism designs without immediate partitioning across multiple FPGAs.
  • Substantial On-Chip Memory:  240,123,904 total RAM bits reduce dependence on external memory for buffering and real-time data processing.
  • Extensive I/O Capability:  816 I/O pins support broad peripheral and high-port-count interfaces directly at the device edge.
  • Industrial Temperature Rating:  Operates from −40 °C to 100 °C, supporting deployed systems with extended ambient and thermal ranges.
  • Advanced Family-Level Integration:  As a Stratix 10 DX device, it benefits from family-level architectural elements such as Hyperflex cores, variable-precision DSPs, EMIB packaging technology, and hardened protocol IP to simplify system-level integration.
  • Compact High-Pin Package:  2912-BBGA FCBGA (2912-FBGA, 55×55) balances high I/O and logic capacity in a single package for space-constrained boards.

Why Choose 1SD280PT2F55I1VGS1?

The 1SD280PT2F55I1VGS1 combines large logic capacity, significant on-chip memory, and high I/O density in an industrial-grade Stratix 10 DX FPGA package. It is positioned for engineers building data‑plane acceleration, high-performance networking, and measurement systems that demand programmable throughput and platform-level integration described by the Stratix 10 DX family.

Choosing this device provides a path to scalable, high-bandwidth designs with family-level capabilities—such as hardened protocol IP and advanced packaging technologies—backed by documented Stratix 10 DX architecture features. The part is suited to teams that require a dense programmable fabric with robust thermal and supply specifications for deployed systems.

Request a quote or submit an inquiry for pricing and availability to move your design forward with 1SD280PT2F55I1VGS1.

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