1SD280PT3F55E3VGS2
| Part Description |
Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 1,338 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 816 | Voltage | 870 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 2753000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SD280PT3F55E3VGS2 – Stratix® 10 DX FPGA, 2912‑FBGA (55×55)
The 1SD280PT3F55E3VGS2 is an Intel Stratix® 10 DX field programmable gate array supplied in a 2912‑FBGA (55×55) package. As a Stratix 10 DX device, it delivers a high‑capacity programmable fabric paired with the family’s advanced architecture features targeted at datacenter, networking, cloud computing, and test & measurement applications.
With 2,753,000 logic elements, 240,123,904 total RAM bits and 816 I/O pins, this surface‑mount, extended‑grade FPGA is designed for dense, high‑throughput designs where integration, on‑die IP and high I/O counts are required. Voltage supply and thermal operating range are specified to support system integration and deployment.
Key Features
- High Logic Capacity Provides 2,753,000 logic elements for large, complex designs and high levels of parallelism.
- Large On‑Chip Memory Includes 240,123,904 total RAM bits to support buffering, packet processing, large state machines and data‑intensive algorithms.
- Extensive I/O 816 I/O pins enable broad peripheral connectivity, high lane counts for external interfaces, and flexible board routing.
- Stratix 10 DX Family Architecture Part of the Stratix 10 DX family, which features the Intel Hyperflex core architecture, advanced packaging (EMIB), and family support for high‑performance hardened IP blocks.
- High‑Speed Transceiver and Hard IP Options Stratix 10 DX family devices include high‑speed transceivers and hard IP options such as PCIe Gen4 and 100 Gigabit Ethernet; specific features vary by device within the family.
- Advanced Memory and Processor Options (Family) Select Stratix 10 DX devices support HBM2 stacked DRAM and/or an integrated quad‑core Arm Cortex‑A53 hard processor subsystem; availability is device dependent.
- Power and Supply Specified device voltage supply range: 870 mV to 970 mV, enabling designers to target defined power architectures.
- Package and Mounting 2912‑FBGA (55×55) package, surface mount, with package case noted as 2912‑BBGA, FCBGA for board integration planning.
- Operating Range and Grade Extended grade with an operating temperature range of 0 °C to 100 °C suitable for demanding commercial and datacenter environments.
- Regulatory RoHS compliant.
Typical Applications
- Datacenter Acceleration Use the device’s high logic capacity and large on‑chip memory to implement hardware accelerators, data path pipelines and custom offload engines for cloud workloads.
- High‑Performance Networking High I/O count and Stratix 10 DX family transceiver and hard IP options make this FPGA suitable for packet processing, line cards and high‑speed switching fabrics.
- Cloud and Storage Interfaces Family support for PCIe Gen4 and DDR‑T memory controllers enables integration with high‑throughput host interfaces and persistent memory options on suitable devices.
- Test & Measurement Large programmable fabric and memory capacity support real‑time signal processing, protocol emulation and complex instrumentation control.
Unique Advantages
- Scalable Logic and Memory Density: 2,753,000 logic elements and 240,123,904 RAM bits provide the headroom needed for multi‑function, high‑parallel designs.
- Broad I/O Flexibility: 816 I/O pins enable multi‑lane interfaces and extensive peripheral connectivity without external muxing or complex board‑level serialization in many designs.
- Family‑Level Integration Options: As part of the Stratix 10 DX family, designers can leverage hardened IP (PCIe Gen4, Ethernet), EMIB packaging and optional HBM2/HPS on select devices to reduce external component count and simplify system architecture.
- Defined Power and Thermal Envelope: A specified supply range of 870 mV–970 mV and 0 °C–100 °C operating range make it straightforward to plan power delivery and thermal management for commercial and datacenter systems.
- Extended Grade for Rigorous Use: Extended grade marking supports deployment in demanding commercial applications where a wider operating window is required.
- RoHS Compliance: RoHS‑compliant status supports regulatory requirements for many global deployments.
Why Choose 1SD280PT3F55E3VGS2?
The 1SD280PT3F55E3VGS2 provides a high‑capacity Stratix 10 DX FPGA platform well suited to dense, high‑bandwidth designs that require large logic and memory resources alongside a substantial I/O complement. Its family heritage brings advanced architecture features—such as the Hyperflex core architecture and EMIB packaging—and access to hardened IP options that help accelerate system-level integration.
This device is aimed at teams building datacenter accelerators, networking equipment, cloud interface logic and sophisticated test systems who need a scalable, documented FPGA solution with clear electrical and thermal specifications. The combination of logic density, memory, I/O and extended grade operation supports long‑term deployment and iterative system development.
Request a quote or submit an inquiry to purchase this Intel Stratix® 10 DX FPGA and get pricing and availability information for your design requirements.

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