1SD280PT3F55E3VGS2

IC FPGA 816 I/O 2912FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA

Quantity 1,338 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package2912-FBGA (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O816Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2753000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SD280PT3F55E3VGS2 – Stratix® 10 DX FPGA, 2912‑FBGA (55×55)

The 1SD280PT3F55E3VGS2 is an Intel Stratix® 10 DX field programmable gate array supplied in a 2912‑FBGA (55×55) package. As a Stratix 10 DX device, it delivers a high‑capacity programmable fabric paired with the family’s advanced architecture features targeted at datacenter, networking, cloud computing, and test & measurement applications.

With 2,753,000 logic elements, 240,123,904 total RAM bits and 816 I/O pins, this surface‑mount, extended‑grade FPGA is designed for dense, high‑throughput designs where integration, on‑die IP and high I/O counts are required. Voltage supply and thermal operating range are specified to support system integration and deployment.

Key Features

  • High Logic Capacity  Provides 2,753,000 logic elements for large, complex designs and high levels of parallelism.
  • Large On‑Chip Memory  Includes 240,123,904 total RAM bits to support buffering, packet processing, large state machines and data‑intensive algorithms.
  • Extensive I/O  816 I/O pins enable broad peripheral connectivity, high lane counts for external interfaces, and flexible board routing.
  • Stratix 10 DX Family Architecture  Part of the Stratix 10 DX family, which features the Intel Hyperflex core architecture, advanced packaging (EMIB), and family support for high‑performance hardened IP blocks.
  • High‑Speed Transceiver and Hard IP Options  Stratix 10 DX family devices include high‑speed transceivers and hard IP options such as PCIe Gen4 and 100 Gigabit Ethernet; specific features vary by device within the family.
  • Advanced Memory and Processor Options (Family)  Select Stratix 10 DX devices support HBM2 stacked DRAM and/or an integrated quad‑core Arm Cortex‑A53 hard processor subsystem; availability is device dependent.
  • Power and Supply  Specified device voltage supply range: 870 mV to 970 mV, enabling designers to target defined power architectures.
  • Package and Mounting  2912‑FBGA (55×55) package, surface mount, with package case noted as 2912‑BBGA, FCBGA for board integration planning.
  • Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C suitable for demanding commercial and datacenter environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Datacenter Acceleration  Use the device’s high logic capacity and large on‑chip memory to implement hardware accelerators, data path pipelines and custom offload engines for cloud workloads.
  • High‑Performance Networking  High I/O count and Stratix 10 DX family transceiver and hard IP options make this FPGA suitable for packet processing, line cards and high‑speed switching fabrics.
  • Cloud and Storage Interfaces  Family support for PCIe Gen4 and DDR‑T memory controllers enables integration with high‑throughput host interfaces and persistent memory options on suitable devices.
  • Test & Measurement  Large programmable fabric and memory capacity support real‑time signal processing, protocol emulation and complex instrumentation control.

Unique Advantages

  • Scalable Logic and Memory Density:  2,753,000 logic elements and 240,123,904 RAM bits provide the headroom needed for multi‑function, high‑parallel designs.
  • Broad I/O Flexibility:  816 I/O pins enable multi‑lane interfaces and extensive peripheral connectivity without external muxing or complex board‑level serialization in many designs.
  • Family‑Level Integration Options:  As part of the Stratix 10 DX family, designers can leverage hardened IP (PCIe Gen4, Ethernet), EMIB packaging and optional HBM2/HPS on select devices to reduce external component count and simplify system architecture.
  • Defined Power and Thermal Envelope:  A specified supply range of 870 mV–970 mV and 0 °C–100 °C operating range make it straightforward to plan power delivery and thermal management for commercial and datacenter systems.
  • Extended Grade for Rigorous Use:  Extended grade marking supports deployment in demanding commercial applications where a wider operating window is required.
  • RoHS Compliance:  RoHS‑compliant status supports regulatory requirements for many global deployments.

Why Choose 1SD280PT3F55E3VGS2?

The 1SD280PT3F55E3VGS2 provides a high‑capacity Stratix 10 DX FPGA platform well suited to dense, high‑bandwidth designs that require large logic and memory resources alongside a substantial I/O complement. Its family heritage brings advanced architecture features—such as the Hyperflex core architecture and EMIB packaging—and access to hardened IP options that help accelerate system-level integration.

This device is aimed at teams building datacenter accelerators, networking equipment, cloud interface logic and sophisticated test systems who need a scalable, documented FPGA solution with clear electrical and thermal specifications. The combination of logic density, memory, I/O and extended grade operation supports long‑term deployment and iterative system development.

Request a quote or submit an inquiry to purchase this Intel Stratix® 10 DX FPGA and get pricing and availability information for your design requirements.

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