1SD280PT3F55I3VG

The 1SD280PT3F55I3VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) packaged in a 2912‑FBGA (55×55) surface‑mount package. It delivers high logic density and large on‑device RAM combined with an extensive I/O count, targeting high‑performance acceleration, networking, datacenter and test & measurement applications.

Key value comes from its large logic element capacity, substantial embedded RAM, industrial temperature grading, and low‑voltage core operation—enabling dense, high‑performance system implementations in compact BGA form factors.

Key Features

• High Logic Density — 2,753,000 logic element cells to implement complex acceleration, protocol, and signal processing designs.
• Large On‑Chip Memory — 240,123,904 total RAM bits for large frame buffers, lookup tables, and state storage without immediate external DRAM.
• Extensive I/O — 816 I/O pins to support wide parallel interfaces, many peripherals, and high‑channel count systems.
• Family‑Level Performance & IP — As part of the Intel Stratix 10 DX family, the device benefits from family innovations such as the Intel Hyperflex core architecture, high‑speed transceiver and hard IP options (family features include support for PCIe Gen4 and multi‑protocol transceivers).
• Package and Mounting — 2912‑BBGA FCBGA / 2912‑FBGA (55×55) package in a surface‑mount form factor for board‑level integration.
• Industrial Grade and Temperature Range — Industrial grade device rated for operation from −40 °C to 100 °C, suitable for demanding environments.
• Low‑Voltage Core Supply — Core voltage range of 870 mV to 970 mV for optimized power delivery and compatibility with system power architectures.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Datacenter Acceleration — Implement compute and data‑plane acceleration functions where high logic density and large on‑chip RAM reduce external memory bandwidth dependency.
• Networking & Telecom — Utilize high I/O count and family transceiver/IP options for packet processing, protocol offload, and line‑rate networking functions.
• Cloud Computing & Edge Infrastructure — Deploy in systems requiring scalable programmable logic for virtualization, I/O aggregation, and custom offload engines.
• Test & Measurement — Leverage high logic capacity and dense I/O to implement custom instrumentation, data capture, and real‑time processing pipelines.

Unique Advantages

• Massive Logic Capacity: 2.75 million+ logic element cells enable ambitious designs without partitioning across multiple FPGAs.
• Built‑In Memory Resources: Over 240 million bits of embedded RAM reduce reliance on external memory for many buffering and state‑storage tasks.
• High I/O Scalability: 816 I/Os provide flexibility for multi‑lane interfaces, parallel sensors, and large peripheral sets.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in demanding thermal environments.
• Optimized Power Domain: Core supply between 870 mV and 970 mV supports modern low‑voltage power delivery designs.
• Compact System Integration: 2912‑FBGA (55×55) package enables dense PCB routing and high‑performance board designs in a single‑package FPGA solution.

Why Choose 1SD280PT3F55I3VG?

The 1SD280PT3F55I3VG positions itself for high‑performance system designs that require a combination of very high logic density, substantial embedded RAM, and broad I/O capability in an industrial‑rated BGA package. Its alignment with the Intel Stratix 10 DX family means designers can leverage family innovations—such as advanced core architecture and high‑speed interface IP—while selecting a device with specific density, I/O and packaging that match system requirements.

Choose this device when your design priorities include large programmable fabric capacity, on‑chip memory to reduce external DRAM reliance, and a robust industrial temperature range for deployment in enterprise, networking, or measurement systems.

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