1SG040HH1F35E2VG

The 1SG040HH1F35E2VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) device offering a large logic fabric and substantial on-chip memory. It combines 378,000 logic elements, 31,457,280 bits of RAM and 374 I/O in a 1152-FBGA (35×35) surface-mount package.

This Extended-grade FPGA operates over a 770 mV to 970 mV supply range and is specified for 0 °C to 100 °C environments, making it suitable for designs that require high logic density, significant embedded memory, and a high I/O count in a compact footprint.

Key Features

• Core Logic  378,000 logic elements provide large-scale programmable logic capacity for complex designs and integration of multiple functions on a single device.
• On-Chip Memory  31,457,280 total RAM bits available for data buffering, intermediate storage, and memory-intensive processing without immediate reliance on external memory.
• I/O Capacity  374 I/O pins enable broad connectivity options for peripherals, sensors, and board-level interfaces.
• Package & Mounting  1152-BBGA, FCBGA (1152-FBGA, 35×35) surface-mount package delivers a compact, board-level footprint for high-density designs.
• Power  Supports a core voltage supply range from 770 mV to 970 mV to match system power-domain requirements.
• Temperature & Grade  Extended grade device rated for operation from 0 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing — Implement large custom logic blocks and complex finite-state machines using the device’s 378,000 logic elements and extensive on-chip RAM.
• Multi-I/O system integration — Aggregate and route signals from numerous peripherals or subsystems using the 374 available I/O.
• Embedded acceleration — Offload compute-heavy kernels and buffering tasks to dedicated logic and on-chip RAM to reduce external memory dependence.
• Compact system boards — Integrate substantial functionality in designs constrained by board area using the 1152-FBGA (35×35) package.

Unique Advantages

• Significant logic capacity: 378,000 logic elements allow consolidation of multiple functions and large custom architectures onto a single FPGA.
• Large on-chip memory: 31,457,280 bits of RAM reduce the need for external memory for many buffering and state-storage tasks.
• High I/O count: 374 I/O pins provide flexibility to connect multiple peripherals, sensors, and interfaces without additional I/O expanders.
• Compact FCBGA package: The 1152-FBGA (35×35) footprint enables dense board layouts while keeping package-level routing predictable.
• Power-domain compatibility: Core operation across 770 mV to 970 mV supports designs with low-voltage power architectures.
• Extended-grade rating: Rated for 0 °C to 100 °C operation to support deployments outside of narrow commercial temperature ranges.

Why Choose 1SG040HH1F35E2VG?

The 1SG040HH1F35E2VG delivers a balance of high logic density, substantial on-chip RAM, and a broad I/O complement in a compact 1152-FBGA package. Its Extended-grade specification and defined supply range make it appropriate for designs that need integrated capability and predictable electrical characteristics.

Designers targeting complex, memory-aware logic implementations or systems requiring many external connections will find the device’s combination of logic elements, RAM, and I/O advantageous for reducing board-level complexity and consolidating functions into a single FPGA.

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