1SG040HH2F35E1VG

The 1SG040HH2F35E1VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC in a 1152-BBGA (FCBGA) package. It provides a large logic fabric, substantial on-chip RAM, and a high I/O count for complex digital designs that require significant logic and memory resources.

Designed for systems operating with a core supply in the 770 mV to 970 mV range and an operating temperature window of 0 °C to 100 °C, this Extended-grade device is suited to a broad set of embedded and system-integration applications where logic density, on-chip memory, and plentiful I/O are important.

Key Features

• Logic Capacity — 378,000 logic elements provide substantial programmable fabric for implementing large, parallelizable logic functions and custom datapaths.
• On-Chip Memory — 31,457,280 total RAM bits enable local buffering, large FIFOs, and substantial embedded memory for state and data management.
• I/O Resources — 374 I/O pins support wide external connectivity for interfaces, buses, and parallel peripherals.
• Power — Core voltage operation within a 770 mV to 970 mV range to match system power planning and regulator choices.
• Package — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) for high-ball-count implementations and dense PCB routing.
• Operating Range — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in thermally constrained environments within that window.
• Compliance — RoHS-compliant component for regulatory alignment in lead-free assemblies.

Typical Applications

• Complex digital systems — Use the 378,000 logic elements and large on-chip RAM to implement extensive custom logic, datapaths, and protocol processing.
• High-bandwidth interfacing — Leverage 374 I/Os to connect multiple external devices, parallel buses, or wide data channels.
• System integration and prototyping — The dense FPGA fabric and memory enable consolidation of functions for validation, emulation, or integration of system functions on a single device.

Unique Advantages

• High logic density: 378,000 logic elements allow consolidation of complex functions and larger designs onto a single FPGA, reducing board-level component count.
• Significant embedded RAM: 31,457,280 RAM bits support deep buffering, large lookup tables, and state storage without external memory for many use cases.
• Extensive I/O availability: 374 I/Os provide flexibility for multi-channel interfaces, wide buses, and heterogeneous peripheral connections.
• Compact, high-ball-count package: The 1152-BBGA (1152-FBGA, 35×35) package delivers high pin density for complex routing while maintaining a compact board footprint.
• Low-voltage core operation: Core supply range of 770 mV to 970 mV enables compatibility with modern low-voltage power architectures.
• Extended-grade operation: Rated for 0 °C to 100 °C operation, suitable for systems within that thermal range and for varied deployment environments.

Why Choose 1SG040HH2F35E1VG?

The 1SG040HH2F35E1VG Stratix® 10 GX FPGA targets designs that demand a large programmable fabric, substantial on-chip memory, and a high I/O count in a compact FCBGA package. Its combination of 378,000 logic elements, over 31 million RAM bits, and 374 I/Os makes it well suited for integrating complex digital subsystems and consolidating multiple functions onto a single device.

With RoHS compliance, Extended-grade temperature support, and a low-voltage core operating range, this device offers a reliable building block for engineers focused on scalable designs, system integration, and long-term platform stability.

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