1SG040HH2F35I1VG

The 1SG040HH2F35I1VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152‑FBGA (35×35) package. It delivers high logic density, substantial on‑chip RAM, and a large I/O count in an industrial‑grade, surface‑mount form factor for demanding embedded and industrial designs.

Key value comes from the combination of 378,000 logic elements and 31,457,280 total RAM bits, supporting complex digital designs that require significant logic and memory resources while operating across a wide temperature and supply range.

Key Features

• Core Logic  378,000 logic elements provide high-density programmable logic capacity for complex digital functions and custom hardware acceleration.
• On‑Chip Memory  31,457,280 total RAM bits enable large local buffers, FIFOs, and embedded memory structures to support data‑intensive processing.
• I/O Resources  374 user I/O pins deliver extensive interfacing options for peripherals, sensors, and board-level interconnect.
• Package  Supplied in a 1152‑FBGA (35×35) package (1152‑BBGA, FCBGA packaging noted), optimized for high‑density board designs and surface‑mount assembly.
• Power  Supported supply range from 770 mV to 970 mV to match low‑voltage core requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Mounting and Compliance  Surface mount mounting type with RoHS compliance for lead‑free assembly processes.

Typical Applications

• Industrial Automation  Implements real‑time control, sensor interfacing, and custom logic for factory automation systems leveraging industrial temperature rating and high logic density.
• Signal Processing  Provides the logic and on‑chip memory capacity needed for streaming data pipelines, filtering, and medium‑to‑large scale DSP blocks.
• Communications & Networking Equipment  Supports protocol handling, packet processing, and I/O aggregation using abundant logic elements and 374 I/O pins.
• Test & Measurement  Enables custom instrumentation logic, data capture, and buffering with substantial RAM and flexible I/O.

Unique Advantages

• High Logic Density: 378,000 logic elements accommodate complex, multi‑function designs without immediate migration to larger devices.
• Large On‑Chip Memory: 31,457,280 RAM bits reduce dependence on external memory for many buffering and data‑flow tasks.
• Generous I/O Count: 374 I/O pins simplify interfacing to multiple peripherals and high‑pin‑count connectors.
• Industrial‑Grade Operation: −40 °C to 100 °C rating supports deployment in harsher environments typical of industrial systems.
• Compact, Surface‑Mount Package: 1152‑FBGA (35×35) enables high‑density PCB layouts while supporting standard surface‑mount assembly.
• Low‑Voltage Core Supply: 770 mV to 970 mV supply range aligns with modern low‑voltage FPGA core domains.

Why Choose 1SG040HH2F35I1VG?

The 1SG040HH2F35I1VG positions itself as a high‑density, industrial‑grade FPGA option for designs that require a combination of extensive logic resources, significant on‑chip memory, and broad I/O capability in a compact surface‑mount package. Its specifications make it suitable for engineers building complex control, processing, and interfacing functions where temperature range and RoHS compliance matter.

This part is well suited to development and deployment scenarios that need scalable programmable logic capacity and substantial embedded RAM without sacrificing industrial temperature support, enabling longer product lifecycles and adaptability to evolving design requirements.

Request a quote or submit a purchase inquiry to get pricing and availability for the 1SG040HH2F35I1VG Stratix® 10 GX FPGA.