1SG040HH3F35E2LG

The 1SG040HH3F35E2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) from Intel. It delivers a high level of on-chip integration with 378,000 logic elements and 31,457,280 bits of embedded RAM, targeted at designs that require significant programmable logic and memory resources.

With 374 I/O, a compact 1152-BBGA (1152-FBGA, 35×35) package and surface-mount mounting, this device suits board-level applications needing dense logic, substantial on-chip storage, and a high pin count while operating within a supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity  Offers 378,000 logic elements to implement large-scale custom logic, datapath, and control functions.
• On-chip Memory  Provides 31,457,280 total RAM bits for buffering, storage, and fast local data access without relying on external memory.
• I/O Count  374 I/O pins enable dense board-level connectivity for multiple parallel interfaces and mixed-signal front ends.
• Power Supply  Designed for operation within a core supply range of 820 mV to 880 mV, supporting targeted power domains on modern FPGA boards.
• Package & Mounting  Supplied in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) and intended for surface-mount assembly to minimize board footprint.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for reliable operation within that ambient window.
• Compliance  RoHS compliant, supporting environmental and regulatory considerations for lead-free assembly.

Typical Applications

• High-density programmable logic systems  Used where large amounts of custom logic are required; the 378,000 logic elements enable complex finite-state machines, custom datapaths, and hardware accelerators.
• Embedded memory‑intensive designs  On-chip 31,457,280-bit RAM supports buffering, packet queues, and local storage to reduce dependency on external memory in many designs.
• High‑pin-count interface boards  With 374 I/O, the device is suitable for boards requiring multiple parallel interfaces, signal multiplexing, or dense peripheral connectivity.
• Compact, surface‑mount applications  The 1152-FBGA (35×35) package and surface-mount mounting enable compact board layouts where PCB area is at a premium.

Unique Advantages

• Highly integrated logic and memory: Combines 378,000 logic elements with over 31 million bits of on-chip RAM to reduce external component count and simplify system architecture.
• Broad I/O capability: 374 I/O pins provide the flexibility to connect multiple interfaces and peripherals without additional I/O expanders.
• Compact BGA packaging: The 1152-FBGA (35×35) package supports high-density board designs and straightforward surface-mount assembly.
• Defined operating envelope: Extended grade and a specified operating temperature range of 0 °C to 100 °C make thermal planning and qualification straightforward for compatible environments.
• Vendor-backed component: Manufactured by Intel, offering the supply-chain and manufacturing traceability associated with a major FPGA provider.
• Environmentally compliant: RoHS compliance supports lead-free manufacturing processes and regulatory alignment.

Why Choose 1SG040HH3F35E2LG?

The 1SG040HH3F35E2LG positions itself as a high-capacity Stratix® 10 GX FPGA option for designs that demand large programmable logic fabric and substantial on-chip RAM while maintaining a compact BGA form factor. Its combination of 378,000 logic elements, 31,457,280 RAM bits, and 374 I/O enables consolidation of functions that might otherwise require multiple devices.

This FPGA is suited to development teams and engineers looking for a scalable, vendor-supported programmable device with clear electrical and thermal envelopes (820 mV–880 mV supply, 0 °C–100 °C operating temperature) and RoHS compliance for modern board assembly processes.

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