1SG040HH3F35E2VG

The 1SG040HH3F35E2VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC from Intel. It combines high logic density and substantial on-chip RAM to support complex, custom digital designs.

With 378,000 logic elements, 31,457,280 total RAM bits and 374 I/O, this device is targeted at applications requiring significant programmable logic, large on-chip memory, and a high I/O count, delivered in a 1152-ball FCBGA package.

Key Features

• Core Logic 378,000 logic elements provide a large programmable fabric for complex digital functions and parallel processing.
• On‑Chip Memory 31,457,280 total RAM bits enable substantial local buffering, state storage, and memory-intensive algorithms.
• I/O Capacity 374 I/O pins support high connectivity for external interfaces, sensors, and peripherals.
• Power Supply Range Operates from 770 mV to 970 mV to match system power-rail requirements within the specified range.
• Package and Mounting 1152-BBGA / FCBGA package (supplier package: 1152-FBGA (35×35)) with surface mount mounting type for compact board implementations.
• Operating Grade and Temperature Extended grade device rated for operation from 0 °C to 100 °C to meet a broad set of deployment environments.
• RoHS Compliant Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High‑density digital systems — Implement large custom logic functions and parallel pipelines using the device's 378,000 logic elements.
• Memory‑intensive designs — Leverage 31,457,280 RAM bits for buffering, lookup tables, and data staging on chip.
• I/O‑heavy systems — Use 374 I/O pins to interface with multiple peripherals, sensors, or high-channel-count front ends.
• Compact board-level integration — Surface-mount FCBGA package supports space-constrained PCB layouts while maintaining high integration.

Unique Advantages

• High logic density: 378,000 logic elements enable implementation of large, complex designs without immediate need for multiple devices.
• Large on‑chip memory: 31,457,280 RAM bits reduce dependence on external memory for many buffering and stateful functions.
• Generous I/O count: 374 I/O pins allow broad external connectivity and flexible system partitioning.
• Compact FCBGA package: 1152-ball package provides a balance of integration and board-level footprint for high-performance applications.
• Extended operating range: Rated 0 °C to 100 °C to support a wide range of deployed system environments.
• RoHS compliant: Conforms to environmental requirements for reduced hazardous substances.

Why Choose 1SG040HH3F35E2VG?

The 1SG040HH3F35E2VG delivers a combination of substantial logic resources, abundant on‑chip memory, and a high I/O count in a single FCBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for designs that require robust on-board programmability and significant local memory without external components.

This device is well suited for engineering teams building complex, custom digital systems that benefit from high integration, flexible I/O, and sizable on-chip RAM, offering a scalable platform for evolving design requirements.

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