1SG040HH3F35I2LG

IC FPGA STRATIX10GX 1152FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 374 31457280 378000 1152-BBGA, FCBGA

Quantity 1,099 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O374Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs47250Number of Logic Elements/Cells378000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits31457280

Overview of 1SG040HH3F35I2LG – Stratix® 10 GX FPGA, 1152-BBGA

The 1SG040HH3F35I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC offering high logic capacity and substantial on-chip memory in a 1152-BBGA FCBGA package. It is an industrial-grade, surface-mount device with a defined operating range and power envelope suitable for demanding embedded and system-level designs.

Key device parameters include 378,000 logic elements, 31,457,280 total RAM bits, 374 user I/Os, a supply voltage window of 820 mV to 880 mV, and an industrial operating temperature range of -40°C to 100°C.

Key Features

  • Core Logic — 378,000 logic elements provide substantial programmable logic capacity for complex designs and integration of multiple functions into a single FPGA.
  • On‑chip Memory — 31,457,280 total RAM bits deliver a large internal memory pool for buffering, packet processing, and algorithm implementation without relying solely on external memory.
  • I/O and Package — 374 user I/Os and a 1152-BBGA (35×35) FCBGA supplier device package support high pin-count connectivity in a compact surface-mount form factor.
  • Power — Designed for operation with a nominal supply range of 820 mV to 880 mV, enabling defined power budgeting for system design.
  • Temperature and Grade — Industrial grade with an operating temperature range of -40°C to 100°C for deployments that require extended temperature tolerance.
  • Regulatory — RoHS compliant.

Unique Advantages

  • High logic density: 378,000 logic elements allow consolidation of complex functions and reduce the need for multiple discrete logic devices.
  • Large internal RAM: Over 31 million RAM bits enable substantial on-chip buffering and memory-intensive processing without immediate dependence on external memory.
  • Extensive I/O: 374 I/Os support broad system interfacing options, helping integrate diverse peripherals and high-pin-count designs.
  • Industrial robustness: Specified -40°C to 100°C operation and an industrial grade designation support use in temperature-challenging environments.
  • Compact, deployable package: 1152-BBGA FCBGA surface-mount package provides a high-density, board-friendly footprint for space-constrained systems.
  • Compliance — RoHS compliance simplifies environmental and regulatory planning.

Why Choose 1SG040HH3F35I2LG?

The 1SG040HH3F35I2LG positions itself as a high-capacity, industrial-grade Stratix® 10 GX FPGA suitable for designs that require large programmable logic, significant on-chip memory, and substantial I/O connectivity. Its defined supply voltage range and extended operating temperature make it appropriate for applications where predictable electrical and thermal characteristics are important.

This device is well suited for engineers and system designers who need to consolidate complex functions into a single FPGA, leverage abundant internal RAM, and maintain operation across a wide temperature range while using a compact 1152-BBGA FCBGA surface-mount package.

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