1SG040HH3F35I1VG

The 1SG040HH3F35I1VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a high-density 1152‑BBGA FCBGA package. It delivers large on-chip logic and memory resources and is specified for industrial-grade operation.

With 378,000 logic elements, 31,457,280 bits of on-chip RAM and 374 I/Os, this device targets complex digital designs that require substantial programmable logic, significant memory, and broad I/O connectivity within a surface-mount package.

Key Features

• Logic Capacity — 378,000 logic elements to implement large-scale digital designs and complex FPGA fabric implementations.
• On‑Chip Memory — 31,457,280 total RAM bits for buffering, lookup tables, and data storage inside the device.
• I/O Resources — 374 I/O pins to support extensive external interfacing and signal routing.
• Package — 1152‑BBGA, FCBGA package; supplier device package listed as 1152‑FBGA (35×35) for high-density board integration.
• Power Supply — Core voltage range specified from 770 mV to 970 mV to match system power-rail design requirements.
• Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting Type — Surface mount device suitable for modern PCB assembly and automated production processes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Large logic density and industrial temperature range support complex control algorithms, real-time state machines, and factory automation interfaces.
• High‑Performance Data Processing — Extensive on‑chip RAM and logic elements enable hardware-accelerated data buffering, parsing, and custom processing pipelines.
• Networking and Infrastructure — High I/O count and large programmable fabric facilitate packet processing, protocol handling, and custom interface bridging.
• Signal Processing and Test Equipment — The combination of logic capacity and memory supports digital signal chains, filtering, and measurement logic blocks.

Unique Advantages

• High Integration — Combines large logic capacity and extensive on‑chip RAM to reduce external component count and simplify board-level designs.
• Broad I/O Connectivity — 374 I/Os provide flexibility for multi‑lane interfaces, sensors, peripherals, and system expansion without additional bridge devices.
• Industrial Reliability — Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Compact, High‑Density Package — 1152‑BBGA/1152‑FBGA (35×35) packaging enables dense PCB layouts for space-constrained systems.
• Power‑Optimized Core Voltage — Core supply range of 770 mV to 970 mV helps align the device with modern low-voltage power architectures.
• Standards‑Aware Manufacturing — RoHS compliance supports environmentally conscious production and global market requirements.

Why Choose 1SG040HH3F35I1VG?

This Stratix® 10 GX FPGA provides a balanced combination of high logic density, substantial on‑chip RAM, and a large number of I/Os in an industrial-grade, surface-mount package. It is positioned for engineers and system designers who need a programmable, high-capacity FPGA platform for demanding applications that require reliability across extended temperature ranges.

For designs that demand scalability and reduced board-level complexity, the 1SG040HH3F35I1VG offers the resources to consolidate functions into a single device, supporting long-term platform development and robust system integration.

Request a quote or submit your requirements today to receive pricing and availability information for the 1SG040HH3F35I1VG. Our team can assist with lead times and volume options to support your project schedule.