1SG040HH3F35I3XG

The 1SG040HH3F35I3XG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) in an 1152-BBGA (35×35) FCBGA package. It provides a high logic density device with 378,000 logic elements, 31,457,280 total RAM bits and 374 user I/O pins, intended for designs that require significant on-chip logic, memory and I/O capacity.

This industrial-grade FPGA operates over a supply voltage range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, offering component-level specifications suitable for temperature-demanding system environments.

Key Features

• High Logic Capacity — 378,000 logic elements to implement complex digital designs and large-scale custom logic functions.
• On-Chip Memory — 31,457,280 total RAM bits for buffering, packet processing, and large lookup tables without immediate external memory dependence.
• Extensive I/O — 374 user I/O pins to support dense system interfacing and multiple high-pin-count peripherals.
• Package — Supplied in an 1152-BBGA, FCBGA (35×35) package for surface-mount board integration and compact system footprints.
• Power — Operates from 820 mV to 880 mV supply rails, enabling designs optimized around this supply window.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation, suitable for industrial application temperature ranges.
• Compliance — RoHS compliant for regulatory alignment with lead-free manufacturing processes.

Typical Applications

• High-density digital processing — Implement large custom processing pipelines, accelerators or protocol logic using abundant logic elements and on-chip RAM.
• I/O-intensive systems — Support complex board-level interfacing and multi-channel connectivity with 374 available I/O pins.
• Industrial control and automation — Deploy in control platforms that require industrial temperature operation and high logic/memory resources.
• Data buffering and packet processing — Use the significant on-chip RAM for temporary storage and packet handling within networking or communication subsystems.

Unique Advantages

• Large programmable fabric: 378,000 logic elements provide headroom for complex algorithms, state machines and parallel datapaths on a single device.
• Substantial on-chip memory: 31,457,280 RAM bits reduce dependence on external memory for many buffering and lookup tasks, simplifying board design.
• Wide I/O capability: 374 I/Os enable integration of numerous peripherals and high-pin-count interfaces without multiplexing compromises.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in temperature-challenging environments.
• Compact BGA package: 1152-BBGA (35×35) FCBGA balances high pin count with a space-conscious footprint for dense PCB layouts.
• Regulatory readiness: RoHS compliance aligns the component with lead-free manufacturing requirements.

Why Choose 1SG040HH3F35I3XG?

The 1SG040HH3F35I3XG positions itself as a high-capacity, industrial-grade Stratix® 10 GX FPGA suitable for designs that demand abundant logic, significant on-chip memory and extensive I/O. Its combination of 378,000 logic elements, over 31 million RAM bits and 374 I/Os makes it appropriate for complex digital systems, I/O-dense boards and industrial applications requiring extended temperature operation.

For engineering teams targeting scalable, robust FPGA-based solutions, this device offers measurable on-chip resources and a compact BGA package that help reduce external component needs and simplify board-level integration. The RoHS compliance and defined supply voltage and temperature ranges provide clear, verifiable parameters for system design and procurement.

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