1SG065HH1F35E1VG

The 1SG065HH1F35E1VG is a Stratix® 10 GX field programmable gate array (FPGA) offering a high-density, programmable logic fabric combined with substantial on-chip memory and a wide I/O count. It is delivered in a 1152-BBGA FCBGA package (1152-FBGA, 35×35) for surface-mount applications.

Key hardware metrics include 612,000 logic elements, 51,380,224 bits of total RAM, and 392 I/O pins. The device operates from a 770 mV to 970 mV core supply and is specified for an operating temperature range of 0 °C to 100 °C with an Extended grade and RoHS compliance.

Key Features

• Core Logic — 612,000 logic elements provide substantial programmable logic capacity for complex designs.
• Logic Blocks — 76,500 logic blocks supporting the distribution of logic resources across the device.
• On-chip Memory — 51,380,224 bits of total RAM to support large buffers, FIFOs, and embedded data storage.
• I/O Resources — 392 I/O pins to accommodate a wide range of external interfaces and parallel connectivity needs.
• Power — Core voltage supply range of 770 mV to 970 mV, enabling compatibility with targeted power-rail designs.
• Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount assembly.
• Temperature & Grade — Extended grade device rated for 0 °C to 100 °C operation.
• Compliance — RoHS compliant.

Unique Advantages

• High logic density: 612,000 logic elements enable consolidation of complex functions onto a single device, reducing board-level integration.
• Large on-chip RAM: Over 51 million bits of RAM support extensive buffering and state storage without relying on external memory.
• Generous I/O count: 392 I/O pins provide flexibility for multiple parallel interfaces and high-pin-count designs.
• Compact FCBGA package: The 1152-BBGA (35×35) package balances pin count and board footprint for space-constrained systems.
• Defined power envelope: Clear core supply range (770 mV–970 mV) simplifies power-rail planning and system integration.
• Extended operating range: Rated for 0 °C to 100 °C, enabling use in applications requiring that temperature window.

Why Choose 1SG065HH1F35E1VG?

The 1SG065HH1F35E1VG positions itself as a high-density, memory-rich FPGA option in a compact FCBGA package. Its combination of 612,000 logic elements, 51,380,224 bits of RAM, and 392 I/O pins makes it suitable for designs that require significant on-chip resources and flexible connectivity while maintaining a controlled power and thermal profile.

This device is well suited to development efforts that demand consolidation of logic and memory into a single package, offering a path to reduce external components and simplify board-level design within the specified voltage and temperature limits.

Request a quote or submit an inquiry to receive pricing and availability information for the 1SG065HH1F35E1VG.