1SG040HH3F35I2VG

The 1SG040HH3F35I2VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC offering a high-density programmable logic fabric and substantial on-chip RAM. Its specification set focuses on large logic capacity, significant embedded memory, and broad I/O connectivity for industrial-grade applications.

Packaged in a 1152-BBGA/FCBGA (1152-FBGA, 35×35) and specified for surface-mount assembly, this device targets designs that require a compact footprint, extensive I/O, and operation across an extended industrial temperature range.

Key Features

• Logic Fabric 378,000 logic elements provide substantial programmable logic capacity for complex custom digital designs.
• On-Chip Memory 31,457,280 total RAM bits support data buffering, state storage, and on-chip working memory for logic functions.
• I/O Connectivity 374 I/O pins enable interfacing with numerous external peripherals, sensors, and high-channel-count systems.
• Power Supply Core operating voltage range from 770 mV to 970 mV to match system power-rail requirements.
• Package and Mounting 1152-BBGA/FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount construction for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Regulatory Compliance RoHS compliant to support environmental and material requirements.

Typical Applications

• Industrial Control Systems Use the device’s industrial temperature rating and large logic capacity for real-time control, sequencing, and automation tasks.
• I/O-Intensive Embedded Platforms 374 I/Os enable connecting many sensors, actuators, or parallel interfaces in embedded or machine-control designs.
• Custom Digital Acceleration High logic element count and on-chip RAM support implementation of custom hardware functions and data-path acceleration within system constraints.
• Compact Board-Level Modules The 1152-FBGA package and surface-mount mounting allow integration into space-constrained modules and carrier boards.

Unique Advantages

• High Logic Density: 378,000 logic elements enable consolidation of complex logic into a single device, reducing system BOM and board space.
• Significant On-Chip Memory: Over 31 million bits of RAM provide local storage for buffers, FIFOs, and state machines, minimizing external memory needs.
• Extensive I/O Count: 374 I/Os allow flexible interfacing with multiple peripherals and parallel buses without external expander logic.
• Industrial Robustness: −40 °C to 100 °C operating range and industrial grade designation support deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 1152-BBGA (1152-FBGA, 35×35) package supports dense board layouts and module integration.
• Low-Voltage Core Operation: Core supply range of 770 mV to 970 mV aligns with modern low-voltage system power domains.

Why Choose 1SG040HH3F35I2VG?

The 1SG040HH3F35I2VG balances large programmable logic capacity, substantial on-chip RAM, and a high I/O count in a compact BGA package. Its industrial-grade temperature specification and RoHS compliance make it suitable for designs where reliability and environmental conformity matter.

This FPGA is well suited for designers and teams building complex, I/O-rich systems that require significant on-chip resources and compact integration. Selecting a Stratix® 10 GX device provides a clear path for consolidating logic functions, reducing external components, and supporting deployments across a wide operating-temperature range.

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