1SG040HH3F35E3VG

The 1SG040HH3F35E3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides a large programmable fabric with substantial on-chip RAM and a high pin count, intended for designs that require significant logic capacity and memory integration.

With 378,000 logic elements, 31,457,280 bits of total RAM and 374 I/Os, this device targets applications that need dense logic, extensive buffering or working memory, and broad I/O connectivity while operating within a 0 °C to 100 °C range and a 770 mV to 970 mV core supply window.

Key Features

• Logic Capacity — 378,000 logic elements to support large, complex programmable logic designs.
• On-Chip Memory — 31,457,280 total RAM bits for substantial data buffering, state storage, and implementation of memory-intensive functions.
• I/O Count — 374 I/Os to accommodate high-channel-count interfaces and complex board-level interconnects.
• Power Supply Range — Core voltage supply range from 770 mV to 970 mV to fit platform power domains and regulator designs.
• Package & Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35); surface-mount component for standard PCB assembly.
• Operating Range — Rated for operating temperatures from 0 °C to 100 °C and designated as Extended grade.
• Regulatory — RoHS compliant.

Typical Applications

• Signal Processing — Implements algorithms that require large logic fabrics and significant on-chip RAM for filtering, transforms, and data buffering.
• High-Density I/O Aggregation — Aggregates and routes many parallel channels using 374 I/Os for multi-channel interfaces and data concentrators.
• Prototyping and System Integration — Provides the logic capacity and memory resources needed for complex system prototypes and integration of multiple functions on a single device.

Unique Advantages

• Substantial Logic Resources — 378,000 logic elements enable implementation of large combinational and sequential designs without frequent partitioning.
• Large On-Chip Memory — Over 31 million bits of RAM reduce the need for external memory in many buffering and stateful applications.
• Extensive I/O — 374 I/Os simplify board-level connectivity and support diverse interface requirements.
• Compact, Surface-Mount Package — 1152-BBGA (35×35) FCBGA package supports high-density PCB layouts and standard SMT assembly flows.
• Extended Temperature Rating — 0 °C to 100 °C operating range suitable for platforms that operate across typical commercial and extended environments.
• RoHS Compliant — Meets RoHS requirements for environmental compliance.

Why Choose 1SG040HH3F35E3VG?

The 1SG040HH3F35E3VG combines a large programmable fabric, extensive on-chip memory, and a high I/O count in a single FCBGA package, making it a practical choice for engineers building systems that demand dense logic and memory integration. Its extended temperature range and RoHS compliance provide predictable behavior across a broad set of deployments.

This device is well suited for design teams who need to consolidate complex functions onto a single FPGA, reduce external memory dependence, and support numerous interfaces while maintaining standard surface-mount assembly practices.

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