1SG040HH2F35I2VG

The 1SG040HH2F35I2VG is a Stratix® 10 GX field programmable gate array (FPGA) from Intel, offered in a 1152-BBGA FCBGA package. It provides a large logic fabric and substantial on-chip RAM for designs that require high integration and significant programmable logic resources.

With 378,000 logic elements, 31,457,280 bits of total RAM, and 374 I/O, this device addresses complex digital designs that demand high logic density, abundant memory, and a broad I/O complement while operating across an industrial temperature range.

Key Features

• Core Logic 378,000 logic elements for implementing large-scale digital designs and complex processing pipelines.
• On-Chip Memory 31,457,280 bits of total RAM to support deep buffering, large state machines, and memory-intensive algorithms.
• I/O Resources 374 I/O pins to connect dense peripheral sets, high-speed interfaces, and multi-channel systems.
• Power Supply Operates from a core voltage range of 770 mV to 970 mV, enabling compatibility with specified power delivery designs.
• Package and Mounting Surface-mount 1152-BBGA (1152-FBGA, 35×35) package for compact board integration and standardized assembly processes.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature capability.
• Manufacturer Backing Part of the Intel Stratix® 10 GX family, identifiable by the Stratix® 10 GX naming in the product title.

Typical Applications

• High-density digital systems: Systems that require extensive programmable logic and on-chip memory to implement large custom logic functions.
• Data buffering and packet processing: Designs that benefit from large RAM capacity for deep buffering and stateful packet or stream processing.
• Multi-channel I/O systems: Applications needing many I/O connections for interfacing multiple sensors, peripherals, or external devices.

Unique Advantages

• Substantial logic capacity: 378,000 logic elements enable implementation of complex, high-function-count designs without external gate arrays.
• Large on-chip RAM: 31,457,280 bits of RAM reduce reliance on external memory for buffering and accelerate on-chip data handling.
• Broad I/O availability: 374 I/O pins support diverse connectivity and simplify board-level integration for multi-interface applications.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Standard surface-mount package: 1152-BBGA (1152-FBGA, 35×35) enables compact PCB layouts and established assembly processes.
• Defined core voltage range: 770 mV to 970 mV allows predictable power design around the device’s specified supply window.

Why Choose 1SG040HH2F35I2VG?

The 1SG040HH2F35I2VG positions itself as a high-capacity Stratix® 10 GX FPGA option for engineers who need extensive programmable logic, generous on-chip RAM, and a wide complement of I/O in an industrial-grade package. Its combination of 378,000 logic elements, over 31 million bits of RAM, and 374 I/O makes it suitable for complex digital designs where integration and reliability across temperature extremes matter.

Targeted at development teams building dense logic fabrics with significant memory requirements, this device delivers a scalable platform for advanced system designs while fitting standard surface-mount assembly flows and industrial operating conditions.

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