1SG040HH2F35E2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 374 31457280 378000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,712 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 374 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 47250 | Number of Logic Elements/Cells | 378000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 31457280 |
Overview of 1SG040HH2F35E2LG – Stratix® 10 GX FPGA, 378,000 logic elements, 31,457,280-bit RAM, 1152-FBGA
The 1SG040HH2F35E2LG is a Stratix® 10 GX field programmable gate array (FPGA) from Intel, delivered in a 1152-FBGA (35×35) surface-mount package. This device provides large programmable logic capacity and substantial on-chip RAM for complex digital designs.
With 378,000 logic elements, 31,457,280 total RAM bits and 374 I/O pins, the part targets applications that require high logic density, on-chip memory and a broad I/O count while operating within a low-voltage supply range of 820 mV to 880 mV.
Key Features
- Logic Capacity — 378,000 logic elements to implement large-scale, user-defined digital functions.
- On-Chip Memory — 31,457,280 total RAM bits for buffering, data storage and local memory requirements.
- I/O Count — 374 I/O pins to support multiple external interfaces and parallel connections.
- Power Supply — Operates from a supply voltage range of 820 mV to 880 mV, enabling low-voltage system integration.
- Package and Mounting — 1152-FBGA (35×35) package, surface-mount mounting type for compact board layouts.
- Operating Range and Grade — Extended grade with an operating temperature range of 0°C to 100°C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 378,000 logic elements provide the capacity to consolidate complex functions and reduce external components.
- Large on-chip memory: 31,457,280 bits of RAM reduce reliance on external memory for many buffer and state-storage needs.
- Broad I/O availability: 374 I/Os enable flexible interfacing to peripherals, sensors and parallel data paths.
- Compact surface-mount package: 1152-FBGA (35×35) supports dense PCB designs while maintaining a high pin count.
- Low-voltage operation: 820–880 mV supply range supports integration into low-voltage power domains.
- Extended temperature grade: Rated 0°C to 100°C for deployment in applications requiring above-commercial operating limits.
Why Choose 1SG040HH2F35E2LG?
The 1SG040HH2F35E2LG combines substantial logic capacity, large on-chip RAM and a high I/O count in a compact 1152-FBGA package, making it suitable for designs that demand dense programmable logic and local memory. Its low-voltage supply range and extended temperature grade add flexibility for varied system environments.
For engineers and procurement teams seeking a high-capacity Stratix® 10 GX FPGA with verifiable on-chip resources and RoHS compliance, this part offers a balance of integration and design headroom while fitting surface-mount board architectures.
Request a quote or contact sales to obtain pricing, availability and lead-time information for the 1SG040HH2F35E2LG.

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