1SG040HH2F35E2LG

IC FPGA STRATIX10GX 1152FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 374 31457280 378000 1152-BBGA, FCBGA

Quantity 1,712 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O374Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs47250Number of Logic Elements/Cells378000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits31457280

Overview of 1SG040HH2F35E2LG – Stratix® 10 GX FPGA, 378,000 logic elements, 31,457,280-bit RAM, 1152-FBGA

The 1SG040HH2F35E2LG is a Stratix® 10 GX field programmable gate array (FPGA) from Intel, delivered in a 1152-FBGA (35×35) surface-mount package. This device provides large programmable logic capacity and substantial on-chip RAM for complex digital designs.

With 378,000 logic elements, 31,457,280 total RAM bits and 374 I/O pins, the part targets applications that require high logic density, on-chip memory and a broad I/O count while operating within a low-voltage supply range of 820 mV to 880 mV.

Key Features

  • Logic Capacity — 378,000 logic elements to implement large-scale, user-defined digital functions.
  • On-Chip Memory — 31,457,280 total RAM bits for buffering, data storage and local memory requirements.
  • I/O Count — 374 I/O pins to support multiple external interfaces and parallel connections.
  • Power Supply — Operates from a supply voltage range of 820 mV to 880 mV, enabling low-voltage system integration.
  • Package and Mounting — 1152-FBGA (35×35) package, surface-mount mounting type for compact board layouts.
  • Operating Range and Grade — Extended grade with an operating temperature range of 0°C to 100°C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 378,000 logic elements provide the capacity to consolidate complex functions and reduce external components.
  • Large on-chip memory: 31,457,280 bits of RAM reduce reliance on external memory for many buffer and state-storage needs.
  • Broad I/O availability: 374 I/Os enable flexible interfacing to peripherals, sensors and parallel data paths.
  • Compact surface-mount package: 1152-FBGA (35×35) supports dense PCB designs while maintaining a high pin count.
  • Low-voltage operation: 820–880 mV supply range supports integration into low-voltage power domains.
  • Extended temperature grade: Rated 0°C to 100°C for deployment in applications requiring above-commercial operating limits.

Why Choose 1SG040HH2F35E2LG?

The 1SG040HH2F35E2LG combines substantial logic capacity, large on-chip RAM and a high I/O count in a compact 1152-FBGA package, making it suitable for designs that demand dense programmable logic and local memory. Its low-voltage supply range and extended temperature grade add flexibility for varied system environments.

For engineers and procurement teams seeking a high-capacity Stratix® 10 GX FPGA with verifiable on-chip resources and RoHS compliance, this part offers a balance of integration and design headroom while fitting surface-mount board architectures.

Request a quote or contact sales to obtain pricing, availability and lead-time information for the 1SG040HH2F35E2LG.

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