1SG040HH1F35I2LG

The 1SG040HH1F35I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC offering high logic density and extensive on-chip memory. Built as a surface-mount 1152-BBGA (1152-FBGA, 35×35) package and rated for industrial use, it targets designs that require large programmable logic capacity, significant RAM resources and substantial I/O connectivity.

Key Features

• Logic Capacity  378,000 logic elements provide substantial programmable logic resources for complex digital designs.
• On‑chip Memory  Total RAM capacity of 31,457,280 bits supports buffering, caching and data-path storage directly on the FPGA.
• I/O Count  374 I/O pins enable dense external connectivity and interface flexibility.
• Power Supply  Specified supply range of 820 mV to 880 mV for core operation.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount assembly.
• Operating Temperature  Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Grade  Industrial grade specification for applications requiring extended temperature performance.

Typical Applications

• High‑density digital processing  Use the large logic fabric and on‑chip RAM for complex signal processing pipelines and algorithm acceleration.
• Interface aggregation  High I/O count supports multi‑lane and multi‑interface aggregation between subsystems.
• Embedded compute and control  Programmable logic and memory resources enable deterministic control and custom compute functions in industrial systems.

Unique Advantages

• Significant programmable capacity: 378,000 logic elements reduce the need for multiple devices by consolidating large designs into a single FPGA.
• Large on‑chip RAM: 31,457,280 bits of RAM enable local buffering and reduce external memory dependence for many designs.
• Extensive I/O connectivity: 374 I/O pins support multiple external interfaces and high‑pin count systems integration.
• Industrial temperature rating: −40 °C to 100 °C operation provides suitability for environments requiring extended thermal range.
• Compact, surface‑mount package: 1152-BBGA (35×35) delivers high density in a manufacturable surface‑mount form factor.
• Controlled core supply range: 820–880 mV specification provides clear power requirements for system power delivery design.

Why Choose 1SG040HH1F35I2LG?

The 1SG040HH1F35I2LG positions itself as a high‑density, industrial‑grade Stratix® 10 GX FPGA that combines a large logic fabric, multi‑megabit on‑chip RAM and a high I/O count in a compact 1152‑BBGA package. It is well suited for engineers designing complex digital systems that need consolidated programmable logic, significant local memory and extensive external interfacing within an industrial temperature envelope.

Choosing this device supports designs that prioritize integration and thermal robustness while providing a clear power supply specification and a surface‑mount package compatible with standard assembly processes.

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