1SG040HH1F35E1VG

The 1SG040HH1F35E1VG is a Stratix® 10 GX field programmable gate array (FPGA) IC delivering high logic capacity and on-chip memory in a compact FCBGA package. The device integrates a large number of logic elements, substantial RAM resources and a high I/O count, making it suitable for designs that require dense programmable logic and significant memory bandwidth within a surface-mount 1152-FBGA (35×35) footprint.

Key Features

• Logic Capacity — 378,000 logic elements (cells) provide significant programmable logic resources.
• On-Chip Memory — 31,457,280 total RAM bits available for large buffering, data storage, and state memory.
• I/O Density — 374 user I/O pins to support wide parallel interfaces and flexible connectivity.
• Core and Power — Supported voltage supply range of 770 mV to 970 mV for core power domain compatibility.
• Package & Mounting — 1152-BBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount assembly.
• Temperature & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory — RoHS compliant.

Unique Advantages

• High logic density: 378,000 logic elements enable complex, high-capacity designs without immediate need for multiple devices.
• Large on-chip RAM: Over 31 million RAM bits reduce external memory dependency and simplify board-level memory architecture.
• Extensive I/O count: 374 I/Os support broad interfacing options for parallel data paths and multiple external peripherals.
• Compact FCBGA footprint: 1152-FBGA (35×35) package provides a balance of density and board-level routing efficiency for surface-mount designs.
• Controlled core voltage range: Core supply of 770 mV–970 mV provides clear power design targets for regulators and sequencing.
• Extended operating range: 0 °C to 100 °C grade supports deployment in a wide set of temperature environments.

Why Choose 1SG040HH1F35E1VG?

The 1SG040HH1F35E1VG delivers substantial programmable logic and memory resources in a surface-mount FCBGA package, offering a compact, high-capacity solution for designs that require dense logic, significant on-chip RAM, and a high number of I/Os. Its extended temperature grade and defined core voltage range make it straightforward to integrate into systems with specific thermal and power constraints.

This part is appropriate for teams and projects focused on consolidating logic and memory into a single device footprint while maintaining predictable package and electrical characteristics. The combination of capacity, package density, and RoHS compliance supports long-term design planning and manufacturability.

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