1SD280PT1F55E2VG

IC FPGA STRATIX10DX 2597FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA

Quantity 888 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O816Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells2753000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SD280PT1F55E2VG – Stratix® 10 DX FPGA, 2912‑FBGA (55×55), Extended Grade

The 1SD280PT1F55E2VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) in a 2912‑FBGA (55×55) FCBGA package. It delivers very large logic capacity, extensive embedded RAM, and a high I/O count for designs that require dense programmable logic and wide external connectivity.

Key value comes from the device’s combination of 2,753,000 logic elements, 240,123,904 total RAM bits, and 816 I/O, along with an extended operating grade and low-voltage core supply range to support compact, high‑density FPGA implementations.

Key Features

  • Logic Capacity  2,753,000 logic elements provide a high-density programmable fabric for complex logic and custom acceleration.
  • Embedded Memory  240,123,904 total RAM bits available for buffering, large on-chip data structures, and state storage.
  • I/O Resources  816 user I/O pins to support broad external interfacing and multi-channel connectivity requirements.
  • Power and Core Voltage  Core supply range of 870 mV to 970 mV to match low-voltage system designs.
  • Package and Mounting  2912‑BBGA, FCBGA package (supplier device package: 2912‑FBGA (55×55)) in a surface‑mount form factor for compact board integration.
  • Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for demanding commercial and industrial applications.
  • Regulatory Compliance  RoHS compliant.
  • Documentation and Errata  Device errata and Intel Stratix 10 DX family documentation are available to support integration and qualification activities.

Typical Applications

  • High‑density compute and signal processing  Large logic capacity and extensive embedded RAM enable implementation of complex processing pipelines and buffering on-chip.
  • I/O‑intensive systems  With 816 I/O, the device is suited to designs that require multiple external interfaces or wide parallel data paths.
  • Custom accelerators and prototype platforms  High logic element count and memory resources support development of custom hardware accelerators and large-scale FPGA prototypes.

Unique Advantages

  • Massive programmable capacity: 2,753,000 logic elements provide headroom for large designs and complex feature sets without offloading to external logic.
  • Substantial on‑chip memory: 240,123,904 bits of embedded RAM reduce reliance on external memory for many buffering and stateful functions.
  • Extensive I/O availability: 816 I/O pins allow flexible connectivity to sensors, high‑speed interfaces, and parallel buses.
  • Compact FCBGA package: 2912‑FBGA (55×55) packaging and surface‑mount mounting enable dense PCB layouts while keeping the device footprint controlled.
  • Low‑voltage core operation: 870 mV–970 mV supply range supports low-voltage system architectures and efficient power delivery designs.
  • Extended operating grade: Rated 0 °C to 100 °C to meet a wide range of commercial and industrial temperature requirements.

Why Choose 1SD280PT1F55E2VG?

The 1SD280PT1F55E2VG positions itself as a high‑capacity Stratix® 10 DX FPGA option for engineers building dense, I/O‑rich programmable systems. Its combination of millions of logic elements, hundreds of millions of RAM bits, and hundreds of I/O pins enables consolidation of complex functions onto a single device, reducing board-level complexity.

This device is appropriate for development teams and system designers who require scalable logic resources, significant on‑chip memory, and a compact FCBGA footprint backed by Intel documentation and device errata for integration and long‑term support.

Request a quote or submit a pricing inquiry to evaluate 1SD280PT1F55E2VG for your next high‑density FPGA design.

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