1SD280PT1F55E2VG
| Part Description |
Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 816 240123904 2753000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 888 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 816 | Voltage | 870 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 2753000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SD280PT1F55E2VG – Stratix® 10 DX FPGA, 2912‑FBGA (55×55), Extended Grade
The 1SD280PT1F55E2VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) in a 2912‑FBGA (55×55) FCBGA package. It delivers very large logic capacity, extensive embedded RAM, and a high I/O count for designs that require dense programmable logic and wide external connectivity.
Key value comes from the device’s combination of 2,753,000 logic elements, 240,123,904 total RAM bits, and 816 I/O, along with an extended operating grade and low-voltage core supply range to support compact, high‑density FPGA implementations.
Key Features
- Logic Capacity 2,753,000 logic elements provide a high-density programmable fabric for complex logic and custom acceleration.
- Embedded Memory 240,123,904 total RAM bits available for buffering, large on-chip data structures, and state storage.
- I/O Resources 816 user I/O pins to support broad external interfacing and multi-channel connectivity requirements.
- Power and Core Voltage Core supply range of 870 mV to 970 mV to match low-voltage system designs.
- Package and Mounting 2912‑BBGA, FCBGA package (supplier device package: 2912‑FBGA (55×55)) in a surface‑mount form factor for compact board integration.
- Temperature and Grade Extended grade with an operating temperature range of 0 °C to 100 °C for demanding commercial and industrial applications.
- Regulatory Compliance RoHS compliant.
- Documentation and Errata Device errata and Intel Stratix 10 DX family documentation are available to support integration and qualification activities.
Typical Applications
- High‑density compute and signal processing Large logic capacity and extensive embedded RAM enable implementation of complex processing pipelines and buffering on-chip.
- I/O‑intensive systems With 816 I/O, the device is suited to designs that require multiple external interfaces or wide parallel data paths.
- Custom accelerators and prototype platforms High logic element count and memory resources support development of custom hardware accelerators and large-scale FPGA prototypes.
Unique Advantages
- Massive programmable capacity: 2,753,000 logic elements provide headroom for large designs and complex feature sets without offloading to external logic.
- Substantial on‑chip memory: 240,123,904 bits of embedded RAM reduce reliance on external memory for many buffering and stateful functions.
- Extensive I/O availability: 816 I/O pins allow flexible connectivity to sensors, high‑speed interfaces, and parallel buses.
- Compact FCBGA package: 2912‑FBGA (55×55) packaging and surface‑mount mounting enable dense PCB layouts while keeping the device footprint controlled.
- Low‑voltage core operation: 870 mV–970 mV supply range supports low-voltage system architectures and efficient power delivery designs.
- Extended operating grade: Rated 0 °C to 100 °C to meet a wide range of commercial and industrial temperature requirements.
Why Choose 1SD280PT1F55E2VG?
The 1SD280PT1F55E2VG positions itself as a high‑capacity Stratix® 10 DX FPGA option for engineers building dense, I/O‑rich programmable systems. Its combination of millions of logic elements, hundreds of millions of RAM bits, and hundreds of I/O pins enables consolidation of complex functions onto a single device, reducing board-level complexity.
This device is appropriate for development teams and system designers who require scalable logic resources, significant on‑chip memory, and a compact FCBGA footprint backed by Intel documentation and device errata for integration and long‑term support.
Request a quote or submit a pricing inquiry to evaluate 1SD280PT1F55E2VG for your next high‑density FPGA design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018