1SD21BPT2F53E2VG
| Part Description |
Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 612 99090432 2073 2597-BBGA, FCBGA |
|---|---|
| Quantity | 239 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | N/A | Number of I/O | 612 | Voltage | 870 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 2073000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 99090432 |
Overview of 1SD21BPT2F53E2VG – FPGA
The 1SD21BPT2F53E2VG is a field-programmable gate array offered by Intel. It provides a high-density programmable logic fabric with on-chip memory and a large I/O count for complex system integration.
Key on-device specifications include 2,073,000 logic elements, 99,090,432 total RAM bits, and 612 user I/O pins. The device is supplied RoHS-compliant and documented alongside Intel Stratix 10 DX device errata in the available technical literature.
Key Features
- High-density logic Provisioned with 2,073,000 logic elements, enabling large-scale programmable logic implementations and complex parallel datapaths.
- Large on-chip memory Contains 99,090,432 total RAM bits to support buffering, look-up tables, and embedded data structures without external memory for many functions.
- Extensive I/O 612 general-purpose I/O pins provide broad interface capability for high-bandwidth and multi-channel connectivity.
- Power supply Operates from a core voltage supply range of 870 mV to 970 mV, allowing designs to target specific power domains and regulator choices.
- Thermal and grade Designed to Extended grade with an operating temperature range of 0 °C to 100 °C for deployments where that thermal window is required.
- Surface mount package Surface-mount mounting type supports standard PCB assembly and automated placement.
- Regulatory status RoHS compliant for lead-free assembly and environmental conformity in applicable markets.
Typical Applications
- High-density logic systems Use the 2,073,000 logic elements to implement large custom accelerators, protocol engines, and data-path intensive functions.
- On-chip buffering and state storage Leverage 99,090,432 RAM bits for packet buffering, large FIFOs, and embedded memory structures to reduce external memory dependence.
- Multi-channel interface designs With 612 I/O pins, implement multi-lane or multi-protocol front-end interfaces and extensive I/O aggregation on a single device.
Unique Advantages
- Massive programmable capacity: The 2,073,000 logic elements deliver the scale needed for complex custom logic and high-parallelism architectures.
- Substantial embedded memory: Nearly 100 million RAM bits on-chip reduce the need for external memory and simplify board-level design.
- High I/O density: 612 I/O pins enable broad connectivity for multi-channel systems, sensors, and high-bandwidth interfaces.
- Defined power envelope: Core supply range of 870–970 mV gives clear regulator and power budgeting parameters for integration.
- Extended-grade thermal range: Rated for 0 °C to 100 °C operation to match designs requiring that specified temperature window.
- RoHS compliant: Supports lead-free assembly processes and environmental compliance requirements.
Why Choose 1SD21BPT2F53E2VG?
1SD21BPT2F53E2VG positions itself as a high-capacity FPGA option for designs that require large programmable logic resources, abundant on-chip memory, and significant I/O connectivity. Its specified core voltage range, extended temperature grading, and surface-mount packaging provide practical integration parameters for system-level design and manufacturing.
This device is suited for engineering teams targeting complex, high-density implementations where on-chip memory and I/O count reduce board-level complexity. Technical documentation for the Intel Stratix 10 DX family, including device errata, is available to support detailed design and qualification work.
Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for 1SD21BPT2F53E2VG.

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