1SD21BPT1F53E1VG
| Part Description |
IC FPGA STRATIX10DX 2597FBGA |
|---|---|
| Quantity | 1,052 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2597-FBGA (52.5x52.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2597-BBGA, FCBGA | Number of I/O | 612 | Voltage | 870 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 2073000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 99090432 |
Overview of 1SD21BPT1F53E1VG – Intel Stratix 10 DX FPGA
The 1SD21BPT1F53E1VG is an Intel Stratix 10 DX family field-programmable gate array (FPGA) supplied in a high-density FCBGA package. It delivers a large programmable fabric with extensive on-chip RAM and a high I/O count for demanding, logic- and memory-intensive designs.
Key attributes include roughly 2,073,000 logic elements, nearly 99.1M bits of total on-chip RAM, and 612 I/O pins, making this device suitable where high integration, on-chip memory capacity, and dense I/O are required. The part is offered in an extended temperature grade and is RoHS compliant.
Key Features
- High Logic Capacity — Approximately 2,073,000 logic elements provide substantial programmable logic resources for complex RTL implementations and large-scale designs.
- Large On-Chip Memory — Total RAM bits: 99,090,432, supporting sizable buffering, on-chip data storage, and memory-centric algorithms.
- High I/O Density — 612 I/O pins to support extensive peripheral, interface, and board-level connectivity.
- Package Options — Available in 2597-BBGA / FCBGA package formats; supplier device package listed as 2597-FBGA (52.5 × 52.5), enabling compact, high-pin-count board layouts.
- Power Supply Range — Core voltage supply range: 870 mV to 970 mV, allowing targeted power design and supply sequencing.
- Mounting & Grade — Surface mount device supplied in an Extended grade; operating temperature range: 0 °C to 100 °C.
- Regulatory — RoHS compliant.
- Documentation — Part of the Intel Stratix 10 DX production family; related device errata and technical documentation are available from the manufacturer.
Typical Applications
- High-density programmable logic — Use where large counts of logic elements and extensive on-chip RAM are required to implement complex custom logic and data-paths.
- Memory-intensive designs — On-chip RAM capacity supports applications that need substantial local buffering, caching, or streaming data storage.
- High I/O systems — Systems requiring hundreds of signal interfaces, transceivers, or parallel I/O channels can leverage the 612 I/O pins.
Unique Advantages
- Massive programmable fabric — Roughly 2,073,000 logic elements enable implementation of large-scale logic, accelerators, and custom system functions on a single device.
- Substantial on-chip RAM — Nearly 99.1M bits of RAM reduce dependence on external memory for many partitioned or streaming workloads.
- Extensive I/O capability — 612 I/O pins provide flexibility for high-channel-count systems and complex board-level routing.
- Compact high-pin-count package — 2597-FBGA (52.5 × 52.5) packaging concentrates resources in a space-efficient footprint for dense PCB designs.
- Designed for extended operation — Extended temperature grade and a 0 °C to 100 °C operating range suit a broad set of commercial and industrial-adjacent environments.
- Regulatory compliance — RoHS compliance supports environmental and supply-chain requirements.
Why Choose 1SD21BPT1F53E1VG?
This Intel Stratix 10 DX FPGA is positioned for designs that require a high mix of programmable logic, abundant on-chip memory, and a large number of I/O signals in a compact FCBGA package. The combination of approximately 2.07 million logic elements, nearly 99.1M bits of RAM, and 612 I/Os provides an integrated platform for complex, memory- and I/O-heavy applications.
Choose this part when your design demands high integration density, substantial on-chip buffering, and a concentrated package footprint while operating within the specified 0 °C to 100 °C range and the documented core voltage window. Manufacturer documentation for the Stratix 10 DX family, including device errata, is available to support system-level qualification and integration.
Request a quote or submit an inquiry to receive pricing, lead-time information, and additional technical support for 1SD21BPT1F53E1VG.

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