1SD110PJ3F43E3VG

The 1SD110PJ3F43E3VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) in a 1760‑ball FCBGA package. It delivers high on‑chip logic capacity and memory for complex, programmable digital designs.

With 1,325,000 logic elements, 112,197,632 bits of on‑chip RAM and 528 I/O, this device targets high‑density programmable‑logic applications that require substantial logic, embedded memory and large I/O counts while operating within a core voltage range of 870–970 mV.

Key Features

• Logic Capacity  1,325,000 logic elements for implementing large-scale programmable logic and custom digital functions.
• On‑chip Memory  112,197,632 total RAM bits to support deep buffering, data processing and state storage.
• I/O Density  528 user I/O pins to support broad interfacing requirements and high‑pin‑count system designs.
• Power Supply  Core voltage supply range of 870 mV to 970 mV to match platform power domains and design constraints.
• Package and Mounting  1760‑BBGA (1760‑FBGA 42.5 × 42.5 mm) FCBGA package, surface‑mount for compact, high‑density board layouts.
• Temperature Grade  Extended grade operation from 0 °C to 100 °C for applications requiring wider commercial temperature margins.
• Compliance  RoHS compliant.
• Device Family Documentation  Part of the Intel Stratix 10 DX family with published device documentation and errata for design verification and system integration.

Typical Applications

• High‑Density FPGA Systems  Deploy on programmable compute or logic‑intensive boards where large logic capacity and on‑chip RAM are required.
• Data Handling and Buffering  Leverage substantial on‑chip RAM for packet buffering, streaming data pipelines, and intermediate storage in complex data paths.
• High‑Pin‑Count Interfaces  Use the 528 I/O pins to connect multiple peripherals, high‑speed transceivers or parallel interfaces in system designs.

Unique Advantages

• High Logic Integration: 1,325,000 logic elements enable consolidation of large logic functions into a single FPGA, reducing multi‑chip complexity.
• Large Embedded Memory: 112,197,632 bits of RAM provide on‑device capacity for buffering and data processing without relying solely on external memory.
• Extensive I/O Resources: 528 I/O pins support complex board‑level connectivity and flexible system partitioning.
• Compact FCBGA Package: 1760‑FBGA (42.5 × 42.5 mm) package delivers high density in a surface‑mount form factor suitable for space‑constrained PCBs.
• Extended Operating Range: Rated for 0 °C to 100 °C operation to accommodate designs that require a broader commercial temperature window.
• Documented Device Family: Inclusion in the Intel Stratix 10 DX family means design teams can reference available device documentation and errata during verification and integration.

Why Choose 1SD110PJ3F43E3VG?

The 1SD110PJ3F43E3VG positions itself as a high‑capacity Stratix 10 DX FPGA option for designs that demand substantial logic, memory and I/O within a single, surface‑mount FCBGA package. Its combination of 1,325,000 logic elements and over 112 million bits of embedded RAM supports complex, memory‑heavy architectures while the 528 I/O count enables broad system interfacing.

Engineers and procurement teams seeking a scalable, document‑backed FPGA for commercial and extended‑temperature applications will find this device suitable for consolidating functionality, simplifying board-level design and accelerating system integration efforts.

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