1SD110PJ2F43E2VG
| Part Description |
Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 528 112197632 1325000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 512 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 528 | Voltage | 870 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 1325000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1SD110PJ2F43E2VG – Stratix® 10 DX Field Programmable Gate Array (FPGA), 1,325,000 logic elements
The 1SD110PJ2F43E2VG is an Intel Stratix® 10 DX Field Programmable Gate Array (FPGA) offered in a high-density 1760-FBGA package. It provides 1,325,000 logic elements, 112,197,632 total RAM bits and 528 I/O pins in a surface-mount FCBGA footprint.
Key electrical and environmental parameters include a supply voltage window of 870 mV to 970 mV, an operating temperature range of 0 °C to 100 °C, Extended grade classification, and RoHS compliance—attributes that support compact, high-capacity FPGA implementations.
Key Features
- Logic Capacity 1,325,000 logic elements for implementing large, complex digital designs and custom hardware functions.
- On‑chip Memory 112,197,632 total RAM bits to support buffering, large state machines, and memory‑intensive algorithms.
- I/O Resources 528 I/O pins to enable extensive external connectivity and parallel interfacing with peripherals and subsystems.
- Package & Mounting 1760-BBGA / 1760-FBGA (42.5×42.5 mm) FCBGA package in a surface-mount form factor for dense board integration.
- Power Supply Designed for operation within a 870 mV to 970 mV supply window to match platform power-rail requirements.
- Operating Range & Grade Extended grade with specified operation from 0 °C to 100 °C for a broad set of environmental conditions.
- Compliance RoHS compliant.
Unique Advantages
- High logic density: 1,325,000 logic elements enable highly integrated hardware designs and complex digital processing in a single device.
- Significant on‑chip RAM: 112,197,632 total RAM bits reduce the need for external memory and simplify data buffering and caching architectures.
- Extensive I/O count: 528 I/O pins facilitate high-bandwidth parallel interfaces and flexible system connectivity.
- Compact BGA footprint: 1760-FBGA (42.5×42.5 mm) package supports dense PCB layouts while maintaining a large internal resource set.
- Defined supply window: Narrow 870–970 mV voltage requirement allows predictable power provisioning and integration with regulated supply rails.
- Extended operating range: 0 °C to 100 °C qualification supports deployment across a range of standard thermal environments.
Why Choose 1SD110PJ2F43E2VG?
Manufactured by Intel, the 1SD110PJ2F43E2VG Stratix® 10 DX FPGA combines very high logic capacity and large on‑chip memory with an ample I/O complement in a compact 1760-FBGA surface-mount package. These characteristics make it well suited for designs that require dense programmable logic, substantial internal RAM, and broad external connectivity.
Specifying this device delivers a balance of integration and predictable electrical/thermal constraints—defined supply voltage, extended-grade temperature range, and RoHS compliance—enabling designers to plan power, thermal, and mechanical integration around documented device parameters.
Request a quote or submit an inquiry to receive pricing and availability information for the 1SD110PJ2F43E2VG Stratix® 10 DX FPGA.

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