1SD110PJ2F43E2VG

IC FPGA 528 I/O 1760FBGA
Part Description

Stratix® 10 DX Field Programmable Gate Array (FPGA) IC 528 112197632 1325000 1760-BBGA, FCBGA

Quantity 512 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O528Voltage870 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells1325000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1SD110PJ2F43E2VG – Stratix® 10 DX Field Programmable Gate Array (FPGA), 1,325,000 logic elements

The 1SD110PJ2F43E2VG is an Intel Stratix® 10 DX Field Programmable Gate Array (FPGA) offered in a high-density 1760-FBGA package. It provides 1,325,000 logic elements, 112,197,632 total RAM bits and 528 I/O pins in a surface-mount FCBGA footprint.

Key electrical and environmental parameters include a supply voltage window of 870 mV to 970 mV, an operating temperature range of 0 °C to 100 °C, Extended grade classification, and RoHS compliance—attributes that support compact, high-capacity FPGA implementations.

Key Features

  • Logic Capacity  1,325,000 logic elements for implementing large, complex digital designs and custom hardware functions.
  • On‑chip Memory  112,197,632 total RAM bits to support buffering, large state machines, and memory‑intensive algorithms.
  • I/O Resources  528 I/O pins to enable extensive external connectivity and parallel interfacing with peripherals and subsystems.
  • Package & Mounting  1760-BBGA / 1760-FBGA (42.5×42.5 mm) FCBGA package in a surface-mount form factor for dense board integration.
  • Power Supply  Designed for operation within a 870 mV to 970 mV supply window to match platform power-rail requirements.
  • Operating Range & Grade  Extended grade with specified operation from 0 °C to 100 °C for a broad set of environmental conditions.
  • Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 1,325,000 logic elements enable highly integrated hardware designs and complex digital processing in a single device.
  • Significant on‑chip RAM: 112,197,632 total RAM bits reduce the need for external memory and simplify data buffering and caching architectures.
  • Extensive I/O count: 528 I/O pins facilitate high-bandwidth parallel interfaces and flexible system connectivity.
  • Compact BGA footprint: 1760-FBGA (42.5×42.5 mm) package supports dense PCB layouts while maintaining a large internal resource set.
  • Defined supply window: Narrow 870–970 mV voltage requirement allows predictable power provisioning and integration with regulated supply rails.
  • Extended operating range: 0 °C to 100 °C qualification supports deployment across a range of standard thermal environments.

Why Choose 1SD110PJ2F43E2VG?

Manufactured by Intel, the 1SD110PJ2F43E2VG Stratix® 10 DX FPGA combines very high logic capacity and large on‑chip memory with an ample I/O complement in a compact 1760-FBGA surface-mount package. These characteristics make it well suited for designs that require dense programmable logic, substantial internal RAM, and broad external connectivity.

Specifying this device delivers a balance of integration and predictable electrical/thermal constraints—defined supply voltage, extended-grade temperature range, and RoHS compliance—enabling designers to plan power, thermal, and mechanical integration around documented device parameters.

Request a quote or submit an inquiry to receive pricing and availability information for the 1SD110PJ2F43E2VG Stratix® 10 DX FPGA.

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