1SD110PJ1F43E2VG

The 1SD110PJ1F43E2VG is an Intel Stratix® 10 DX field programmable gate array (FPGA) in a 1760‑ball FCBGA package. It combines very high programmable logic density with large on‑chip RAM and a substantial I/O count for complex, resource‑intensive designs.

Key on‑device specifications include 1,325,000 logic elements, 112,197,632 total RAM bits, 528 I/O, a core supply range of 870 mV to 970 mV, and an extended operating range of 0 °C to 100 °C. Device errata for the Stratix 10 DX family are documented by the manufacturer.

Key Features

• Logic Capacity — 1,325,000 logic elements provide large FPGA fabric for complex combinational and sequential logic implementations.
• On‑chip Memory — 112,197,632 total RAM bits enable large buffering, lookup tables, and data‑storage architectures without external memory.
• I/O Resources — 528 I/O pins support broad peripheral and multi‑lane interfaces and extensive board connectivity.
• Power Supply — Core voltage specified between 870 mV and 970 mV for system power planning and regulator selection.
• Package & Mounting — 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) FCBGA surface‑mount package for high‑density board integration.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for thermally controlled environments.
• Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High‑density programmable logic designs — Implement large custom digital functions that require over a million logic elements.
• Memory‑intensive architectures — Use the substantial on‑chip RAM for buffering, packet processing, or large LUT‑based structures.
• I/O‑rich systems — Integrate many external peripherals, sensor arrays, or multi‑lane interfaces using 528 available I/O pins.
• Compact, board‑level integration — The 1760‑FBGA (42.5 × 42.5 mm) surface‑mount package supports dense PCB layouts where board space is at a premium.

Unique Advantages

• High logic density: 1,325,000 logic elements reduce the need for multi‑device partitioning in large designs.
• Large on‑chip RAM: 112,197,632 total RAM bits enable substantial local storage and reduce external memory dependency.
• Extensive I/O: 528 I/O make it easier to consolidate multiple interfaces and peripherals on a single FPGA.
• Compact FCBGA package: 1760‑FBGA (42.5 × 42.5 mm) provides a high pin‑count footprint in a compact form factor for dense system designs.
• Defined power envelope: Core voltage range of 870 mV to 970 mV supports precise power budgeting and regulator selection.
• RoHS compliant and extended grade: Environmentally compliant manufacturing and an operating range of 0 °C to 100 °C for controlled temperature deployments.

Why Choose 1SD110PJ1F43E2VG?

The 1SD110PJ1F43E2VG is positioned for projects that require very high programmable logic capacity, large on‑chip memory, and wide I/O connectivity while maintaining a compact board footprint. Its defined core voltage range and extended temperature grade allow engineers to plan power and thermal solutions with precision.

For designs that need consolidated functionality in a single FPGA package, this Stratix 10 DX device provides a clear combination of density, memory, and I/O resources—backed by device documentation and errata for the Stratix 10 DX family from the manufacturer.

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