1SD110PJ1F43E1VG

The 1SD110PJ1F43E1VG is a Stratix® 10 DX field programmable gate array (FPGA) offered in a 1760‑FBGA surface‑mount package. This device integrates 1,325,000 logic elements and 112,197,632 bits of on‑chip RAM, with 528 available I/O pins, delivering a high‑density programmable fabric for complex digital designs.

Designed with a low‑voltage core supply range of 870 mV to 970 mV and an operating temperature range of 0 °C to 100 °C, the device is supplied in an extended grade and is RoHS compliant.

Key Features

• Core Logic  1,325,000 logic elements for implementing large-scale, custom digital functions and complex processing pipelines.
• On‑Chip Memory  112,197,632 bits of total RAM to support large buffers, deep FIFOs, and memory‑intensive algorithms directly on the FPGA fabric.
• I/O Capacity  528 I/O pins to accommodate wide parallel interfaces and multiple high‑pin-count connections to external devices.
• Power Supply  Core voltage supply range of 870 mV to 970 mV, enabling integration with low‑voltage power rails.
• Package & Mounting  1760‑FBGA (42.5 × 42.5 mm) FCBGA package, surface mount mounting type for PCB integration where a high‑pin‑count BGA is required.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in applications within this thermal envelope.
• Compliance  RoHS compliant, meeting standard environmental directives for lead‑free assembly.

Typical Applications

• Compute‑Intensive FPGA Designs  Suitable for designs that require extensive programmable logic and on‑chip RAM resources to implement complex algorithms.
• I/O‑Dense Systems  Well suited to systems that need a high number of external interfaces, leveraging the 528 I/O pins for wide buses or multiple peripheral connections.
• Compact Board Integration  The 1760‑FBGA package and surface‑mount profile support compact PCB layouts where a high‑pin‑count BGA footprint is acceptable.

Unique Advantages

• High Logic Capacity: 1,325,000 logic elements provide substantial programmable resources for large designs, reducing the need for multiple devices.
• Large On‑Chip Memory: 112,197,632 bits of RAM enable extensive buffering and local data storage, minimizing external memory bandwidth requirements.
• Extensive I/O: 528 I/O pins allow flexible interfacing with a broad range of peripherals and parallel data paths.
• Compact High‑Pin Package: 1760‑FBGA (42.5 × 42.5 mm) FCBGA delivers a high‑density pinout in a single surface‑mount package for streamlined PCB design.
• Low‑Voltage Core Support: 870 mV to 970 mV supply range supports integration with modern low‑voltage power systems.
• RoHS Compliant: Conforms to lead‑free assembly requirements for environmentally conscious manufacturing.

Why Choose 1SD110PJ1F43E1VG?

The 1SD110PJ1F43E1VG positions itself as a high‑density Stratix® 10 DX FPGA for designs that demand large programmable logic resources, substantial on‑chip RAM, and generous I/O capacity in a single package. Its extended grade and defined operating range make it suitable for applications that operate within 0 °C to 100 °C and require RoHS‑compliant components.

Choose this device when your project requires consolidation of functions into a single, high‑capacity FPGA with a 1760‑FBGA footprint, a low‑voltage core supply range, and extensive memory and I/O resources to support complex, memory‑driven, and I/O‑heavy designs.

Request a quote or contact sales to discuss pricing, availability, and how the 1SD110PJ1F43E1VG can fit into your next design project.