10M50SCE144A7G

The 10M50SCE144A7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC delivering on-chip memory and flexible I/O in a compact surface-mount package. It combines a large logic capacity with significant embedded RAM to support complex programmable logic and buffering requirements.

With AEC-Q100 qualification, an extended operating range of −40°C to 125°C and a nominal supply range of 2.85 V to 3.465 V, this device is specified for applications that require automotive-grade qualification and robust temperature performance.

Key Features

• Core Logic 50,000 logic elements and 3,125 CLBs provide substantial programmable logic capacity for implementing custom digital functions and control logic.
• On‑Chip Memory 1,677,312 total RAM bits of embedded memory to support buffering, lookup tables and local data storage without external RAM.
• I/O and Integration 101 I/O pins enable broad peripheral and interface connectivity for mixed-signal systems, sensors and communication interfaces.
• Power Supply Specified supply range from 2.85 V to 3.465 V to match common system rails and power architectures.
• Package & Mounting 144‑LQFP exposed pad package (supplier device package: 144‑EQFP, 20×20) in a surface-mount format for compact board-level integration and thermal handling via the exposed pad.
• Automotive Qualification & Temperature Range AEC‑Q100 qualification and an operating temperature range of −40°C to 125°C suitable for designs requiring automotive-grade qualification.
• Compliance RoHS compliant for environmental and regulatory consistency in production.

Typical Applications

• Automotive Electronics — Leveraging AEC‑Q100 qualification and −40°C to 125°C operation for in-vehicle programmable logic and control subsystems.
• Custom Logic Integration — Use the 50,000 logic elements and 101 I/O to consolidate discrete interfaces, protocol bridging and bespoke control functions.
• On‑Chip Data Buffering — 1,677,312 RAM bits allow local data storage for real‑time processing, buffering and lookup operations without external memory.

Unique Advantages

• Automotive‑qualified FPGA: AEC‑Q100 qualification and extended temperature rating provide traceable suitability for automotive design cycles and testing requirements.
• High logic density: 50,000 logic elements reduce the need for multiple discrete devices, simplifying board design and lowering BOM complexity.
• Substantial on‑chip memory: Over 1.67 million RAM bits enable memory-intensive functions on-chip, reducing reliance on external memory components.
• Flexible I/O count: 101 I/O pins support diverse peripheral connections and signal interfacing in a single package.
• Compact, thermally conscious package: 144‑LQFP with exposed pad and surface-mount mounting eases PCB layout while supporting thermal dissipation.
• RoHS compliant: Meets environmental compliance requirements for modern manufacturing and supply chains.

Why Choose 10M50SCE144A7G?

The 10M50SCE144A7G positions itself as a high‑capacity, automotive‑qualified FPGA option that combines substantial logic resources, significant on‑chip RAM and flexible I/O in a compact surface‑mount package. Its qualification and temperature range make it suitable for designs where automotive-grade assurance and robust thermal performance are required.

This device is well suited to engineers and teams building programmable control, interface consolidation and memory‑intensive logic within automotive and other temperature‑demanding environments, offering a balance of integration, thermal-conscious packaging and traceable qualification.

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