10M50DDF672C8G

The 10M50DDF672C8G is a MAX® 10 field programmable gate array (FPGA) from Intel, providing a high-density, commercial-grade programmable fabric. It combines up to 50,000 logic elements with substantial on-chip RAM and a large I/O count for applications that require dense logic integration and broad peripheral interfacing.

Designed for commercial applications, this device supports designs that need significant logic capacity, extensive I/O, and on-chip memory while operating within a 1.15 V to 1.25 V supply range and a 0 °C to 85 °C operating temperature window.

Key Features

• Core Capacity – Provides 50,000 logic elements to implement complex digital functions and large-scale combinational/sequential logic.
• On-Chip Memory – Includes 1,677,312 total RAM bits for buffering, state storage, and local data processing.
• I/O Density – Offers 500 I/O pins to support high peripheral count and multi-protocol interfacing.
• Package & Mounting – Supplied in a 672-FBGA (27×27) package with surface-mount mounting for compact board integration.
• Power – Operates from a 1.15 V to 1.25 V voltage supply window, enabling low-voltage system designs.
• Temperature & Grade – Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Manufacturer – Intel MAX® 10 family device, providing a recognizable supplier pedigree.

Typical Applications

• Embedded Systems – Implement control and logic functions that require up to 50,000 logic elements and sizable on-chip memory.
• High‑Density I/O Gateways – Aggregate sensors, peripherals, or protocol interfaces using the device’s 500 I/O pins.
• Data Buffering and Processing – Use 1,677,312 RAM bits for local buffering, packet staging, and stateful data operations.
• Custom Hardware Accelerators – Integrate acceleration blocks and specialized datapaths within the available logic and RAM resources.

Unique Advantages

• High Logic Capacity: 50,000 logic elements enable substantial functional integration on a single device, reducing external glue logic.
• Significant On-Chip Memory: Over 1.6 Mbits of RAM supports local data storage needs and reduces dependency on external memory.
• Extensive I/O Count: 500 I/Os simplify board-level routing for multi-port and multi-protocol designs.
• Compact BGA Packaging: The 672-FBGA (27×27) surface-mount package provides high pin density in a compact footprint for space-constrained PCBs.
• Low-Voltage Operation: Narrow 1.15 V to 1.25 V supply range supports low-power system architectures.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for standard commercial applications and environments.

Why Choose 10M50DDF672C8G?

The 10M50DDF672C8G positions itself as a high-density, commercial-grade FPGA option for designers needing a balance of logic capacity, on-chip RAM, and extensive I/O in a compact BGA package. Its specification set is suited to embedded and system-level designs that require significant programmable logic and local memory while operating within standard commercial temperature and voltage ranges.

For teams focused on integrating substantial digital functionality with high I/O counts and minimizing external components, this MAX® 10 device offers a clear roadmap for scalable designs backed by Intel’s MAX 10 product family pedigree.

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