10M50DDF484C8G

The 10M50DDF484C8G is a commercial‑grade MAX® 10 Field Programmable Gate Array (FPGA) from Intel provided in a 484‑BGA surface‑mount package. It delivers up to 50,000 logic elements and substantial on‑chip RAM, together with a high I/O count, for embedded designs that require dense, reconfigurable logic in a compact footprint.

Designed for commercial applications, this device operates from a core supply of 1.15 V to 1.25 V and supports an operating temperature range of 0 °C to 85 °C, with RoHS compliance documented.

Key Features

• Core Logic — 50,000 logic elements (cells) provide substantial combinational and sequential resources for medium‑to‑high density designs.
• Embedded Memory — 1,677,312 total RAM bits available on‑chip to support buffering, FIFOs, and other memory‑intensive functions without external RAM.
• I/O Capacity — 360 user I/O pins to support multiple external interfaces and reduce the need for external interface logic.
• Power — Core supply voltage specified from 1.15 V to 1.25 V for predictable power budgeting.
• Package & Mounting — 484‑FBGA (23×23) package in a 484‑BGA footprint, surface‑mount mounting for compact PCB integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant.
• Documentation — Part of the Intel MAX 10 device family with published device datasheet and electrical/timing specifications.

Typical Applications

• Commercial embedded systems — Use the device where significant logic capacity and on‑chip memory are required within standard commercial temperature ranges.
• I/O‑dense interface and bridging — Leverage 360 I/Os for designs that consolidate multiple interfaces or reduce external glue logic.
• On‑board system integration and prototyping — Compact 484‑BGA surface‑mount package and reconfigurable logic enable dense board integration and iterative design.

Unique Advantages

• High logic density: 50,000 logic elements enable complex logic implementations without immediate need for higher‑end devices.
• Significant on‑chip RAM: 1,677,312 bits of RAM reduce dependence on external memory for buffering and state storage.
• Large native I/O count: 360 I/Os simplify multi‑interface designs and help minimize additional interface components.
• Compact, industry‑standard package: 484‑FBGA (23×23) facilitates PCB density while maintaining accessible routing for high‑pin‑count designs.
• Commercial operating range: 0 °C to 85 °C aligns with a wide range of commercial deployment environments.
• Vendor documentation: Supported by the Intel MAX 10 device family datasheet for electrical and timing references.

Why Choose 10M50DDF484C8G?

The 10M50DDF484C8G positions itself as a versatile commercial‑grade FPGA offering a balance of logic density, on‑chip memory, and I/O capacity in a compact 484‑BGA package. It is suitable for design teams that need significant reconfigurable resources and high I/O without moving to larger device families.

With documented electrical and timing specifications available in the Intel MAX 10 device datasheet, this part supports predictable design integration, power planning, and system partitioning for commercial embedded applications.

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