10M50DCF672I6G

The 10M50DCF672I6G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, delivering a high-density programmable fabric in a compact 672-BGA package. With 50,000 logic elements, 1,677,312 bits of on-chip RAM and up to 500 I/O, this device targets industrial designs that require substantial logic capacity, memory resources and broad I/O integration.

Engineered for surface-mount applications and rated for an industrial operating range, the device combines logic density, on-chip memory and a high pin count in a 27×27 672-FBGA supplier package, making it suitable for space-constrained boards that demand robust performance across temperature extremes.

Key Features

• Core Logic  50,000 logic elements provide high-density programmable logic for complex combinational and sequential functions.
• Logic Blocks  3,125 logic blocks to structure and partition designs for manageable synthesis and routing.
• On-Chip Memory  1,677,312 total RAM bits available for FIFOs, buffers, lookup tables and state storage directly on the FPGA fabric.
• I/O Capacity  Up to 500 I/O pins to support high-pin-count interfaces, parallel buses and mixed-signal front-ends.
• Power Supply  Nominal core voltage range of 1.15 V to 1.25 V for predictable supply planning and power budgeting.
• Package & Mounting  672-ball BGA in a 27×27 672-FBGA supplier package; designed for surface-mount PCB assembly in space-constrained layouts.
• Temperature Range  Industrial operating range from −40°C to 100°C for deployment in demanding ambient conditions.
• Compliance  RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Typical Applications

• Industrial automation  Leverages the industrial temperature rating and extensive I/O to handle sensor aggregation, motor control logic and real-time control interfaces.
• High-density I/O subsystems  Up to 500 I/O pins accommodate parallel interfaces, wide buses and multiple peripheral connections on a single device.
• On-board memory-intensive logic  1.68 Mb of on-chip RAM is suited for buffering, packet queues and local data storage without external memory.
• Compact embedded systems  The 672-BGA (27×27) package and surface-mount mounting enable integration into space-limited PCBs while retaining high logic capacity.

Unique Advantages

• High logic density: 50,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Substantial on-chip RAM: 1,677,312 RAM bits provide large local storage for buffering and state machines, minimizing dependence on external memory.
• Extensive I/O: Up to 500 I/O pins support complex, multi‑channel interfaces and diverse peripheral connectivity without additional components.
• Industrial temperature capability: −40°C to 100°C rating supports reliable operation in harsh ambient environments common to industrial deployments.
• Compact, board-friendly package: 672-BGA (27×27) surface-mount package enables high pin count in a small footprint for dense board layouts.
• Regulatory readiness: RoHS compliance facilitates integration into designs targeting regulated and environmentally conscious markets.

Why Choose 10M50DCF672I6G?

The 10M50DCF672I6G positions itself as a balanced solution for designs that demand a combination of high logic capacity, significant on-chip memory and broad I/O in a compact, industrial‑rated package. Its 50,000 logic elements and 1.68 Mb of RAM make it suitable for embedded and industrial applications where consolidating functionality onto a single FPGA can simplify system architecture and reduce component count.

Manufactured by Intel and delivered in a 672-BGA (27×27) surface-mount package, this MAX® 10 device addresses space-constrained boards while providing the thermal margin and I/O resources needed for robust, long-term deployments.

Request a quote or submit an inquiry to obtain pricing and availability for the 10M50DCF672I6G and support planning for your next design.