10M50DCF672C8G

The 10M50DCF672C8G is an Intel MAX® 10 field programmable gate array (FPGA) in a 672-ball BGA package designed for compact, high-density programmable logic applications. It combines a large logic fabric with significant on-chip RAM and a high I/O count to support complex digital functions in space-constrained board designs.

Key value comes from the combination of 50,000 logic elements, 1,677,312 total RAM bits, and up to 500 I/Os in a surface-mount 672-FBGA (27×27) package, with a low-voltage core supply and commercial temperature grading for general-purpose embedded and electronic applications.

Key Features

• Logic Capacity — 50,000 logic elements (cells) provide substantial programmable resources for implementing complex digital logic and custom accelerators.
• Embedded Memory — 1,677,312 total RAM bits support on-chip data buffering, state storage, and intermediate processing without immediate external memory needs.
• I/O Count — Up to 500 I/Os enable dense connectivity for interfaces, peripherals, and multi-channel systems.
• Package & Mounting — 672-BGA (supplier designation 672-FBGA, 27×27) in a surface-mount form factor for compact PCB integration.
• Power — Core voltage supply range of 1.15 V to 1.25 V for the device core domain.
• Operating Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS-compliant for material and process alignment with common environmental requirements.

Typical Applications

• Custom Digital Logic — Implement application-specific state machines, protocol handlers, and hardware-accelerated functions using the device’s 50,000 logic elements and large on-chip RAM.
• I/O-Intensive Interfaces — Support multi-interface bridging and signal aggregation where a high I/O count (500) is required.
• Embedded Processing and Control — Integrate control logic, peripheral management, and buffering in compact designs using the on-chip memory.

Unique Advantages

• High Logic Density: 50,000 logic elements give designers the headroom to consolidate multiple functions into a single FPGA, reducing system complexity.
• Substantial On-Chip Memory: 1,677,312 RAM bits reduce reliance on external memory for many control and buffering tasks, simplifying PCB design.
• Large I/O Capability: Up to 500 I/Os enable direct connection to numerous peripherals and interfaces without extensive external expansion.
• Compact, Surface-Mount Package: 672-FBGA (27×27) supports high-density board layouts while maintaining standard surface-mount assembly processes.
• Low-Voltage Core: 1.15 V to 1.25 V core supply supports modern low-power design considerations for the programmable fabric.
• Regulatory Alignment: RoHS compliance aids integration into products that require adherence to common environmental standards.

Why Choose 10M50DCF672C8G?

The 10M50DCF672C8G positions itself as a versatile, high-density FPGA option for designers who need significant programmable logic, ample on-chip RAM, and extensive I/O in a compact surface-mount BGA package. Its combination of 50,000 logic elements, 1,677,312 RAM bits, and 500 I/Os makes it suitable for consolidating multiple digital functions and interfaces onto a single device while keeping board area constrained.

With a defined commercial temperature range and RoHS compliance, the device offers a balance of performance and manufacturability for mainstream embedded and electronic products that require scalable, reliable programmable logic backed by Intel’s MAX® 10 family documentation.

Request a quote or submit a pricing inquiry to begin the procurement process for the 10M50DCF672C8G.