10M50DCF672C7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 500 1677312 50000 672-BGA |
|---|---|
| Quantity | 910 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 500 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3125 | Number of Logic Elements/Cells | 50000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1677312 |
Overview of 10M50DCF672C7G – MAX® 10 Field Programmable Gate Array, 50,000 logic elements, 672-BGA
The 10M50DCF672C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 672-ball BGA package. It combines mid-range logic density with substantial on-chip RAM and a large I/O count to support versatile digital designs.
Designed for commercial-grade applications, this device offers 50,000 logic elements, 1,677,312 total RAM bits, and 500 I/Os, making it suitable for designs that require integrated logic, memory, and high pin counts within a compact surface-mount package.
Key Features
- Core Logic 50,000 logic elements provide mid-range programmable logic capacity for a wide variety of digital functions.
- On‑Chip Memory 1,677,312 total RAM bits available for embedded data storage, buffering, and local memory functions.
- I/O Density Up to 500 I/Os to support extensive peripheral and interface requirements on a single device.
- Package 672‑BGA package (supplier package: 672‑FBGA, 27×27 mm) in a surface-mount form factor for compact board layouts.
- Power Supply Core voltage range of 1.15 V to 1.25 V to match system power-rail requirements.
- Commercial Grade Specified for 0 °C to 85 °C operating temperature suitable for commercial applications.
- Standards Compliance RoHS compliant.
- Documentation Detailed device datasheet includes electrical characteristics, switching characteristics, configuration specifications, and timing parameters for design validation and integration.
Unique Advantages
- Balanced Logic and Memory: The combination of 50,000 logic elements and over 1.6 Mbit of RAM supports integrated implementations of control, buffering, and data-path logic without immediate reliance on external memory.
- High Pin Count: 500 I/Os enable complex system interfacing and reduce the need for external I/O expanders.
- Compact Surface‑Mount Packaging: 672‑FBGA (27×27) keeps board area compact while providing high routing density for multi‑signal designs.
- Commercial Temperature Range: Specified 0 °C to 85 °C operation fits a wide range of standard commercial environments.
- Regulatory Simplicity: RoHS compliance supports deployment in designs requiring lead‑free assembly.
Why Choose 10M50DCF672C7G?
The 10M50DCF672C7G positions itself as a practical, mid-density FPGA choice for commercial designs that need a balanced combination of logic, on-chip RAM, and a high number of I/Os in a compact BGA package. Its defined core voltage range, documented electrical and timing characteristics, and RoHS compliance make it straightforward to evaluate and integrate into system designs.
This device is well suited for engineers and procurement teams seeking a commercially rated MAX® 10 FPGA with clear specifications for logic capacity, memory, I/O, packaging, and operating conditions, backed by comprehensive datasheet documentation for design and verification.
Request a quote or submit an inquiry to receive pricing and availability for the 10M50DCF672C7G.

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