10M50DCF672C7G

IC FPGA 500 I/O 672FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 500 1677312 50000 672-BGA

Quantity 910 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O500Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3125Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1677312

Overview of 10M50DCF672C7G – MAX® 10 Field Programmable Gate Array, 50,000 logic elements, 672-BGA

The 10M50DCF672C7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 672-ball BGA package. It combines mid-range logic density with substantial on-chip RAM and a large I/O count to support versatile digital designs.

Designed for commercial-grade applications, this device offers 50,000 logic elements, 1,677,312 total RAM bits, and 500 I/Os, making it suitable for designs that require integrated logic, memory, and high pin counts within a compact surface-mount package.

Key Features

  • Core Logic  50,000 logic elements provide mid-range programmable logic capacity for a wide variety of digital functions.
  • On‑Chip Memory  1,677,312 total RAM bits available for embedded data storage, buffering, and local memory functions.
  • I/O Density  Up to 500 I/Os to support extensive peripheral and interface requirements on a single device.
  • Package  672‑BGA package (supplier package: 672‑FBGA, 27×27 mm) in a surface-mount form factor for compact board layouts.
  • Power Supply  Core voltage range of 1.15 V to 1.25 V to match system power-rail requirements.
  • Commercial Grade  Specified for 0 °C to 85 °C operating temperature suitable for commercial applications.
  • Standards Compliance  RoHS compliant.
  • Documentation  Detailed device datasheet includes electrical characteristics, switching characteristics, configuration specifications, and timing parameters for design validation and integration.

Unique Advantages

  • Balanced Logic and Memory: The combination of 50,000 logic elements and over 1.6 Mbit of RAM supports integrated implementations of control, buffering, and data-path logic without immediate reliance on external memory.
  • High Pin Count: 500 I/Os enable complex system interfacing and reduce the need for external I/O expanders.
  • Compact Surface‑Mount Packaging: 672‑FBGA (27×27) keeps board area compact while providing high routing density for multi‑signal designs.
  • Commercial Temperature Range: Specified 0 °C to 85 °C operation fits a wide range of standard commercial environments.
  • Regulatory Simplicity: RoHS compliance supports deployment in designs requiring lead‑free assembly.

Why Choose 10M50DCF672C7G?

The 10M50DCF672C7G positions itself as a practical, mid-density FPGA choice for commercial designs that need a balanced combination of logic, on-chip RAM, and a high number of I/Os in a compact BGA package. Its defined core voltage range, documented electrical and timing characteristics, and RoHS compliance make it straightforward to evaluate and integrate into system designs.

This device is well suited for engineers and procurement teams seeking a commercially rated MAX® 10 FPGA with clear specifications for logic capacity, memory, I/O, packaging, and operating conditions, backed by comprehensive datasheet documentation for design and verification.

Request a quote or submit an inquiry to receive pricing and availability for the 10M50DCF672C7G.

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