10M50DCF484I6G

The 10M50DCF484I6G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 484‑ball BGA package and intended for industrial applications. It integrates 50,000 logic elements, 1,677,312 bits of on‑chip RAM, and up to 360 I/O to support medium‑density programmable logic implementations.

Designed for surface‑mount deployment and operation across a wide voltage range (1.15 V to 1.25 V) and industrial temperature window (‑40 °C to 100 °C), this device targets embedded control, interface consolidation, and programmable logic tasks where integration and predictable temperature performance are required.

Key Features

• Logic Capacity — 50,000 logic elements provide substantial programmable fabric for moderate-complexity designs and custom logic acceleration.
• On‑Chip Memory — 1,677,312 total RAM bits for data buffering, FIFOs, and local storage without external memory dependencies.
• I/O — Up to 360 I/O pins to accommodate multiple interfaces, signal domains, and board-level integration requirements.
• Industrial Grade — Device is specified as Industrial grade with supported speed grade indicated by the part suffix (I6), and operating temperature from ‑40 °C to 100 °C.
• Power — Core supply range of 1.15 V to 1.25 V to match system power rails and manage power budgeting.
• Package & Mounting — 484‑BGA package (supplier package 484‑FBGA, 23 × 23) with surface mount compatibility for compact, high‑density PCB layouts.
• Standards Compliance — RoHS compliant for regulatory and environmental considerations.

Unique Advantages

• Balanced integration: Combines 50,000 logic elements with more than 1.6 Mbit of on‑chip RAM to reduce reliance on external memory and simplify BOM.
• High I/O count: 360 available I/Os enable consolidation of multiple interfaces and peripheral connections on a single FPGA.
• Industrial temperature support: Specified operation from ‑40 °C to 100 °C supports deployments in demanding thermal environments.
• Compact BGA footprint: 484‑ball BGA (23 × 23) provides a high I/O density in a space‑efficient package suitable for surface‑mount assembly.
• Low‑voltage core: Narrow core voltage window (1.15 V to 1.25 V) assists in predictable power budgeting and supply design.
• Regulatory readiness: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose 10M50DCF484I6G?

The 10M50DCF484I6G positions itself as a mid‑density MAX® 10 FPGA option for designers needing a balance of programmable logic, embedded RAM, and a large number of I/Os in an industrial‑grade package. Its combination of 50,000 logic elements, 1,677,312 RAM bits, and 360 I/Os offers headroom for interface consolidation, custom control logic, and on‑device data handling while keeping external component count low.

With a surface‑mount 484‑BGA footprint and operation across a wide industrial temperature range, this device is suitable for applications that require robust thermal performance and compact board integration. The RoHS compliance and defined core voltage range further support reliable, standards‑aware designs.

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