10M50DCF256I7G

The 10M50DCF256I7G is an Intel MAX® 10 field programmable gate array supplied in a 256-LBGA surface-mount package (256-FBGA, 17×17). It provides 50,000 logic elements and 1,677,312 total RAM bits, with 178 user I/O pins and a core supply range of 1.15 V to 1.25 V.

Built to industrial temperature ratings (‑40 °C to 100 °C) and RoHS compliant, this device is intended for designs requiring reconfigurable digital logic with on-chip memory and a high I/O count in a compact BGA footprint.

Key Features

• Core Logic — 50,000 logic elements for implementing complex, reprogrammable digital functions and custom logic architectures.
• On‑chip Memory — 1,677,312 total RAM bits to support buffering, lookup tables, and state storage without external memory.
• I/O Count — 178 user I/O pins suitable for interfacing with multiple peripherals, sensors, and external devices.
• Package & Mounting — 256-LBGA (256-FBGA, 17×17) surface‑mount package that balances density and board-level routing.
• Power Supply — Core voltage range from 1.15 V to 1.25 V to match system power domains.
• Temperature & Grade — Industrial grade operating range of ‑40 °C to 100 °C for deployment in temperature‑sensitive environments.
• Compliance — RoHS compliant to support lead‑free manufacturing requirements.

Typical Applications

• Industrial Automation — Reconfigurable control logic and signal processing for factory automation and process control systems where industrial temperature range is required.
• Embedded Systems — On‑board custom logic and memory for embedded products that need compact, high‑I/O programmable devices.
• Prototyping & Development — Platform for validating custom digital designs and system integration using a high logic‑element count and abundant on‑chip RAM.

Unique Advantages

• High Logic Density: 50,000 logic elements provide headroom for complex logic implementations without external programmable devices.
• Substantial On‑Chip RAM: 1,677,312 total RAM bits reduce dependence on external memory for buffering and LUT storage, simplifying BOM and board routing.
• Generous I/O Provisioning: 178 user I/O pins enable multiple peripheral connections and flexible interface options on a single device.
• Industrial Temperature Rating: Operates from ‑40 °C to 100 °C, supporting deployment in temperature‑challenging environments.
• Compact BGA Package: 256‑LBGA (17×17) offers a space‑efficient package for dense board designs while preserving signal routing capability.
• RoHS Compliant: Supports lead‑free manufacturing and environmental compliance requirements.

Why Choose 10M50DCF256I7G?

The 10M50DCF256I7G balances substantial programmable logic density, on‑chip RAM, and a high I/O count in a compact 256‑LBGA package, making it suitable for embedded and industrial applications that require reconfigurable digital logic within an industrial temperature range. Its defined core voltage window and RoHS compliance help ensure predictable integration into controlled power domains and lead‑free manufacturing flows.

This device is a practical choice for engineers and procurement teams seeking a single‑chip FPGA solution that provides logic capacity, local memory, and I/O flexibility while meeting industrial operating conditions and environmental compliance.

Request a quote or contact sales to discuss availability, pricing, and delivery for the 10M50DCF256I7G.