10M50DCF256C7G

The 10M50DCF256C7G is an Intel MAX® 10 family FPGA supplied in a 256-ball BGA package and targeted for commercial applications. It integrates up to 50,000 logic elements with 1,677,312 bits of on-device RAM and 178 user I/O resources, delivering a balanced combination of logic density, embedded memory, and I/O capacity for compact system designs.

Designed for commercial-temperature operation and RoHS compliance, this device is suitable for commercial embedded systems that require medium-to-high logic capacity in a surface-mount 256-LBGA footprint.

Key Features

• Logic Capacity — 50,000 logic elements with 3,125 logic array blocks, providing substantial programmable logic for combinational and sequential designs.
• On-Chip Memory — 1,677,312 total RAM bits for FIFOs, buffers, and small embedded data stores.
• Rich I/O — 178 general-purpose I/O pins to support multiple external interfaces and peripherals.
• Power Supply — Core supply requirement between 1.15 V and 1.25 V for device operation.
• Package and Mounting — Available in a 256-LBGA package (supplier package: 256-FBGA, 17×17); surface-mount mounting type for PCB assembly.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance — RoHS-compliant device construction.
• Documentation — Supported by Intel MAX 10 FPGA device documentation covering electrical characteristics, configuration specifications, switching and timing parameters.

Typical Applications

• Commercial Embedded Systems — Provides up to 50,000 logic elements and 178 I/O for control, glue-logic, and protocol bridging in commercial products.
• Board-Level Integration — Compact 256-LBGA package supports dense PCB designs that require substantial logic and embedded RAM in a small footprint.
• Prototyping and Development — Useful for developers needing a commercial-grade FPGA with significant on-chip RAM and I/O to validate system functions.

Unique Advantages

• High Logic Density: 50,000 logic elements enable implementation of complex logic functions and moderate system integration without external programmable logic.
• Substantial On-Chip Memory: 1,677,312 bits of RAM reduce dependence on external memory for buffering and temporary data storage.
• Versatile I/O Count: 178 I/O pins allow flexible interfacing to multiple peripherals and board-level buses.
• Compact BGA Package: 256-LBGA (256-FBGA, 17×17 supplier package) supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
• Regulatory-Friendly: RoHS compliance simplifies integration into environmentally regulated product lines.

Why Choose 10M50DCF256C7G?

The 10M50DCF256C7G positions itself as a commercial-grade MAX 10 FPGA option that balances logic capacity, embedded RAM, and I/O for system designers seeking a compact, surface-mount programmable device. Its combination of 50,000 logic elements, over 1.6 Mbits of on-chip RAM, and 178 I/Os makes it appropriate for designs that require meaningful on-device resources without stepping up to larger form factors.

Backed by Intel MAX 10 device documentation covering electrical characteristics, configuration, and timing, the 10M50DCF256C7G offers a documented platform for designs that need verifiable specifications and predictable operating conditions across commercial temperature ranges.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the 10M50DCF256C7G. Our team can provide the details you need to evaluate this FPGA for your next commercial design.