10M50DAF672C8G

The 10M50DAF672C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It provides a high-density programmable fabric targeted at commercial electronic designs.

With 50,000 logic elements, 1,677,312 bits of on-chip RAM and 500 I/O pins in a compact 672-FBGA (27×27) surface-mount package, this device addresses applications that require substantial logic resources, on-chip memory and dense connectivity while operating from a 1.15 V–1.25 V core supply and a 0 °C–85 °C commercial temperature range.

Key Features

• Core Logic — 50,000 logic elements provide substantial programmable logic capacity for complex designs and custom accelerators.
• Embedded Memory — 1,677,312 total RAM bits on-chip for data buffering, state machines and packet or frame storage without external memory.
• High I/O Count — 500 I/O pins enable dense external device connectivity and multiple parallel interfaces.
• Package & Mounting — 672-FBGA (27×27) surface-mount package offers a compact footprint for high-density board layouts.
• Power — Core voltage supply range of 1.15 V to 1.25 V to match common low-voltage domains.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement custom logic, control functions and interfacing in applications that require significant on-chip logic and memory capacity.
• High-density I/O controllers — Support systems that need many parallel or multiplexed external connections using the device’s 500 I/O pins.
• On-chip data buffering and processing — Use the 1,677,312 bits of RAM for temporary storage, packet buffering or streaming data operations without immediate external memory.
• Prototyping and system integration — Leverage the programmable fabric and large logic element count to validate and integrate complex digital functions in commercial designs.

Unique Advantages

• High logic density: 50,000 logic elements provide the capacity to implement large, complex digital functions on a single device.
• Substantial on-chip RAM: 1,677,312 bits of embedded RAM reduce reliance on external memory for many buffering and temporary storage needs.
• Extensive connectivity: 500 I/O pins enable flexible, high-pin-count interfacing to peripherals, sensors and parallel buses.
• Compact, manufacturable package: 672-FBGA (27×27) surface-mount package supports dense PCB layouts while maintaining commercial manufacturability.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial operating environments.
• Regulatory compliance: RoHS compliant to meet common environmental requirements.

Why Choose 10M50DAF672C8G?

The 10M50DAF672C8G positions itself as a high-capacity, commercially graded MAX® 10 FPGA option for designs that demand significant programmable logic, on-chip RAM and a high number of I/O in a compact BGA package. Its combination of 50,000 logic elements, over 1.6 Mbit of RAM and 500 I/O pins supports integration of complex digital functions without immediately resorting to multiple discrete components.

This device is suited for engineering teams and procurement seeking a commercially rated FPGA from Intel with clear, verifiable specifications for logic capacity, memory, I/O density, package type and operating range, enabling scalable designs and predictable integration into commercial electronic products.

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