10M50DCF256A7G

The 10M50DCF256A7G is an Intel MAX® 10 field programmable gate array (FPGA) offered in a 256-pin BGA package. It delivers 50,000 logic elements, 1,677,312 total RAM bits, and 178 I/O pins in a compact surface-mount footprint.

Designed and qualified for automotive use with AEC-Q100, the device supports a 1.15 V to 1.25 V core supply and an extended operating temperature range of −40 °C to 125 °C, addressing applications that require reconfigurable logic with automotive-grade qualification and wide temperature tolerance.

Key Features

• Logic Capacity  50,000 logic elements provide substantial programmable logic resources for complex control, interfacing, and data-processing tasks.
• On-chip Memory  1,677,312 total RAM bits enable local buffering, FIFOs, and small embedded memory structures to support system logic and data handling.
• I/O and Packaging  178 I/O pins in a 256-LBGA package (supplier device package: 256-FBGA, 17×17) for dense connectivity in a compact footprint; surface-mount mounting type.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification, supporting designs that require recognized automotive device qualification.
• Wide Operating Range  Operating temperature from −40 °C to 125 °C to withstand extended-temperature environments.
• Power Supply  Core supply range of 1.15 V to 1.25 V to match system power design constraints.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Automotive Electronics  Reconfigurable logic for in-vehicle systems that benefit from AEC-Q100 qualification and extended temperature operation.
• Sensor and Signal Aggregation  High I/O count and on-chip RAM support aggregation and preprocessing of sensor data in harsh environments.
• Embedded Control  Programmable logic capacity enables customization of control functions and protocol bridging where integration and flexibility are required.
• Industrial Systems  Extended temperature range and robust packaging suit industrial control and monitoring applications that require reliable operation across temperature extremes.

Unique Advantages

• Substantial Logic Density: 50,000 logic elements provide headroom for complex designs and multiple concurrent functions on a single device.
• Integrated Memory Resources: Over 1.6 Mbits of on-chip RAM reduces the need for external memory for buffering and small data structures.
• High Pin Count in Compact Package: 178 I/Os in a 256-LBGA (17×17) package enables dense system I/O while minimizing PCB area.
• Automotive-Grade Qualification: AEC-Q100 qualification and −40 °C to 125 °C operation support deployment in automotive environments and other temperature-demanding applications.
• Low-Voltage Core: 1.15 V–1.25 V supply range facilitates integration into modern low-voltage power domains.
• RoHS Compliance: Meets RoHS requirements for environmentally compliant manufacturing.

Why Choose 10M50DCF256A7G?

The 10M50DCF256A7G delivers a balanced combination of logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package, with specifications aligned for automotive-qualified deployments. Its AEC-Q100 qualification and wide operating temperature range make it suitable for designs where qualification and environmental robustness are critical.

Engineers and procurement professionals looking for a reprogrammable silicon option from the Intel MAX® 10 family can leverage this device to consolidate functions, reduce external components, and maintain configurability throughout development and production life cycles.

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