10M50DCF256C8G

The 10M50DCF256C8G is a commercial-grade MAX® 10 Field Programmable Gate Array (FPGA) from Intel offered in a 256-LBGA package. It provides a mid-density programmable logic fabric with up to 50,000 logic elements and on-chip RAM to support configurable digital functions in commercial electronic designs.

Key device attributes include 1,677,312 total RAM bits, 178 user I/O pins, low-voltage core operation (1.15 V to 1.25 V), and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for a range of general-purpose, board-level programmable logic requirements.

Key Features

• Core Logic — 50,000 logic elements to implement mid-density programmable logic and custom digital functions.
• On-chip Memory — 1,677,312 total RAM bits for buffering, state storage, and small memory-mapped structures.
• I/O Capacity — 178 user I/O pins to support multiple external interfaces and board-level routing.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FBGA 17×17) with surface-mount mounting type for compact board integration.
• Power — Core voltage supply range 1.15 V to 1.25 V to align with modern low-voltage power rails.
• Operating Range — Commercial-grade operating temperature range of 0 °C to 85 °C.
• Standards — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement mid-density custom logic and I/O expansion where up to 50,000 logic elements and 178 I/O are required.
• Interface Bridging and Glue Logic — Use the device’s I/O count and on-chip RAM to create protocol adapters, bus bridges, and board-level glue logic.
• Control and Sequencing — Deploy for state machines, control logic, and sequencing functions leveraging on-chip RAM and configurable logic resources.

Unique Advantages

• Mid-density programmable logic: 50,000 logic elements enable substantial on-chip implementation without moving to higher-density device classes.
• Significant on-chip RAM: 1,677,312 total RAM bits reduce dependence on external memory for many buffering and small-data storage needs.
• High I/O count: 178 I/O pins provide flexibility for multiple peripheral interfaces and board-level connectivity.
• Compact, surface-mount package: 256-LBGA (256-FBGA 17×17) enables dense PCB layouts while supporting board-level manufacturability.
• Low-voltage core operation: 1.15 V to 1.25 V core supply aligns with modern power budgets for efficient system design.
• Commercial-grade qualification: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose 10M50DCF256C8G?

The 10M50DCF256C8G delivers a balanced combination of logic capacity, on-chip RAM, and I/O density in a compact 256-LBGA package, targeted at commercial designs that need configurable logic without the footprint of larger devices. Its 1.15 V–1.25 V core voltage range and RoHS compliance help integrate the device into modern, low-voltage board designs.

As part of the Intel MAX® 10 family, the device is documented in the MAX 10 device datasheet and is positioned for designers seeking mid-density FPGA resources, flexible I/O, and integrated on-chip memory for a wide range of commercial embedded and board-level programmable logic tasks.

Request a quote or submit a parts inquiry to obtain pricing, lead time, and availability for 10M50DCF256C8G.