10M50DAF672I7G

The 10M50DAF672I7G is an Intel MAX® 10 FPGA offered in a 672-ball BGA (27×27) package. It provides a programmable logic fabric with a large logic capacity, on-chip RAM, and extensive I/O for embedded and industrial designs.

With 50,000 logic elements and 1,677,312 bits of RAM, this industrial-grade device supports dense logic integration and flexible interfacing while operating across a 1.15 V–1.25 V core supply range and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  50,000 logic elements and 3,125 LABs provide substantial programmable logic capacity for medium-to-high complexity designs.
• On‑Chip Memory  1,677,312 total RAM bits of embedded memory for buffering, state storage, and fast local data handling.
• High‑Density I/O  Up to 500 I/O pins to support broad peripheral interfacing and multi-channel connectivity within a single package.
• Package and Mounting  672-ball FBG A (27×27) BGA package designed for surface-mount assembly, optimized for board-level density.
• Power Supply  Core voltage range of 1.15 V to 1.25 V for the device core rail.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial thermal environments.
• Compliance  RoHS-compliant construction to meet standard environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Use the device’s logic capacity and wide I/O complement for custom control algorithms, motor control interfaces, and real-time signal processing in industrial environments.
• Embedded and Edge Processing  On-chip RAM and dense logic enable local data handling, preprocessing, and protocol bridging at the system edge.
• High‑Pin Count Interface Modules  The 500 I/O pins make the device suitable for multi‑channel I/O expansion, sensor aggregation, and board-level protocol translation.

Unique Advantages

• Large, Integrated Logic Fabric: 50,000 logic elements (3,125 LABs) let you consolidate multiple functions into a single FPGA, reducing component count and board complexity.
• Significant On‑Chip Memory: 1,677,312 RAM bits provide local buffering and state storage to improve data throughput and reduce external memory dependency.
• Extensive I/O Availability: 500 I/O pins support diverse peripheral connections and parallel interfaces without external multiplexing.
• Industrial‑Grade Thermal Range: −40 °C to 100 °C operating range supports deployment in demanding industrial conditions.
• Compact High‑Density Package: 672-ball 27×27 FBGA package enables high-density board designs while keeping the device surface-mounted for standard assembly flows.
• Standards‑Aware Manufacturing: RoHS compliance aligns the device with common environmental manufacturing requirements.

Why Choose 10M50DAF672I7G?

The 10M50DAF672I7G positions itself as a versatile, industrial-grade MAX® 10 FPGA with a balance of large logic capacity, substantial on-chip memory, and broad I/O resources. It is suited to designs that require significant programmable logic and local memory within a single surface-mount package rated for extended temperature operation.

Choose this device when you need scalable logic density, extensive interfacing, and an industrial operating range—enabling consolidation of functions, simplified BOM, and a compact board footprint for embedded and industrial applications.

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