10M50DAF672I6G

The 10M50DAF672I6G is a MAX® 10 FPGA from Intel provided in a 672-ball BGA package. It integrates up to 50,000 logic elements, 1,677,312 bits of on-chip RAM and supports up to 500 I/Os, providing dense logic and memory resources in a surface-mount industrial-grade device.

Designed for applications requiring a combination of logic capacity, significant embedded RAM and a high I/O count, this device operates from a low-voltage supply rail of 1.15 V to 1.25 V and is rated for operation from -40 °C to 100 °C.

Key Features

• Logic Capacity — 50,000 logic elements for implementing complex combinational and sequential logic functions within a single FPGA.
• On-chip Memory — 1,677,312 total RAM bits to support memory-intensive architectures, buffering and state storage without external RAM.
• High I/O Count — Up to 500 I/Os to accommodate wide parallel interfaces, sensor arrays, or multiple peripheral connections.
• Power Supply — Operates from a 1.15 V to 1.25 V supply, enabling low-voltage system integration.
• Package and Mounting — Surface-mount 672-ball BGA package (supplier device package: 672-FBGA (27x27)) for compact board-level integration.
• Industrial Temperature Range — Rated for -40 °C to 100 °C operation to meet broad industrial environmental requirements.
• Compliance — RoHS compliant to meet environmental and manufacturing standards.

Typical Applications

• High-density logic implementations — Systems that require up to 50,000 logic elements for complex control, glue logic or protocol handling.
• Memory-centric designs — Applications that benefit from on-chip RAM (1,677,312 bits) for buffering, FIFOs or scratchpad storage without external memory.
• Multi-interface systems — Designs needing a large number of I/Os (up to 500) to connect multiple peripherals, sensors or parallel buses.
• Industrial embedded systems — Surface-mount integration and an operating range of -40 °C to 100 °C suit industrial controllers and monitoring equipment.

Unique Advantages

• Significant logic density: 50,000 logic elements enable consolidation of multiple functions into a single device, reducing board complexity.
• Substantial on-chip RAM: 1,677,312 bits of embedded RAM reduce or eliminate the need for external memory in many designs, lowering BOM cost and board area.
• Extensive I/O capacity: 500 I/Os accommodate diverse interfaces and high pin-count peripherals without multiplexing compromises.
• Industrial temperature capability: -40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact surface-mount BGA package: 672-ball BGA (672-FBGA (27x27)) enables dense PCB layouts while maintaining robust electrical connections.
• Low-voltage operation: 1.15 V to 1.25 V supply minimizes power draw and simplifies low-voltage system integration.

Why Choose 10M50DAF672I6G?

The 10M50DAF672I6G positions itself as a high-capacity, industrial-grade FPGA option combining large logic resources, on-chip RAM and a high I/O count in a compact 672-ball BGA package. Its low-voltage supply range and wide operating temperature make it suitable for embedded systems that demand both density and environmental robustness.

This device is well suited for design teams and OEMs that need to consolidate multiple functions, reduce external memory requirements, and support complex interfacing on a single FPGA. Its combination of specifications provides a scalable platform for medium- to high-complexity FPGA implementations.

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