10M50DAF672C6G

The 10M50DAF672C6G is a MAX® 10 field programmable gate array (FPGA) from Intel supplied in a 672-ball BGA package. It integrates 50,000 logic elements, over 1.67 million bits of on-chip RAM and up to 500 I/O pins, making it suitable for medium- to high-density programmable logic tasks in commercial embedded designs. Its low-voltage core (1.15–1.25 V) and surface-mount 672-FBGA (27×27) footprint support compact board-level implementations for a range of applications.

Key Features

• Core Logic — 50,000 logic elements provide substantial programmable capacity for glue logic, state machines, and custom datapaths.
• Logic Block Count — 3,125 logic blocks reported for structural partitioning and mapping of logic resources.
• On-Chip Memory — 1,677,312 total RAM bits enable buffering, FIFOs and local data storage without external memory.
• I/O Capability — Up to 500 I/O pins support dense peripheral interfacing, multi-channel I/O and complex bus implementations.
• Power — Core supply range of 1.15 V to 1.25 V supports low-voltage system designs and power budgeting.
• Package & Mounting — 672-ball Fine-pitch BGA (27 × 27 mm) in a surface-mount configuration for compact PCB integration.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C suitable for typical indoor and controlled-environment applications.
• Regulatory — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Embedded Control — Implement control logic and custom state machines using the device’s 50,000 logic elements and abundant I/Os for sensor and actuator interfacing.
• Communications and Networking — Use the extensive I/O count and on-chip RAM for protocol bridging, packet buffering and interface adaptation in commercial gear.
• Consumer and Industrial Electronics — Integrate custom user interfaces, data aggregation and preprocessing tasks where a compact BGA package and commercial temperature range are appropriate.
• Prototyping and System Integration — Leverage the MAX® 10 FPGA’s logic density and memory to consolidate discrete logic and accelerate time-to-market for new designs.

Unique Advantages

• Substantial Logic Capacity: 50,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level complexity.
• Large On-Chip Memory: 1,677,312 RAM bits provide ample local storage for buffering, temporary data, and algorithm acceleration without immediate external memory.
• High I/O Density: Up to 500 I/O pins accommodate complex peripheral sets and parallel interfaces, minimizing external glue logic.
• Compact BGA Package: 672-FBGA (27×27 mm) surface-mount package supports dense PCB layouts and streamlined mechanical integration.
• Low-Voltage Core: 1.15–1.25 V supply range aids in low-power system designs and aligns with common modern power rails.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for regulatory and environmental consistency.

Why Choose 10M50DAF672C6G?

The 10M50DAF672C6G delivers a balance of logic density, on-chip memory and I/O capability in a compact surface-mount BGA package, making it well suited for commercial embedded designs that require significant programmable resources. Its commercial operating temperature range and low-voltage core make it appropriate for indoor and controlled-environment applications where consolidation of functions and board-space savings are priorities.

Manufactured by Intel and offered with RoHS compliance, this MAX® 10 FPGA is a practical choice for designers building medium- to high-density programmable logic into consumer, communications, and embedded systems seeking a single-chip integration strategy.

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