10M50DAF484I6G

The 10M50DAF484I6G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) provided in a 484-ball FBGA package (23×23). It integrates 50,000 logic elements, 1,677,312 total RAM bits and supports up to 360 I/O pins, delivering a highly configurable platform for embedded logic and system integration.

Designed for surface-mount PCB assembly and rated for industrial operation, this device supports a supply voltage range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that demand robustness and substantial on-chip logic and memory resources.

Key Features

• Core Logic  Contains 50,000 logic elements to implement complex custom logic, state machines, and control functions.
• Embedded Memory  Provides 1,677,312 total RAM bits for on-chip buffering, FIFOs, and tightly coupled data storage.
• I/O Density  Offers 360 I/O pins to support multiple parallel interfaces, sensor and actuator connectivity, or multi-channel data paths.
• Package & Mounting  484-ball FBGA (23×23) surface-mount package for compact board-level integration and high pin-count routing.
• Power  Requires a core supply in the range of 1.15 V to 1.25 V to meet device operating conditions.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for extended-environment use.
• Compliance  RoHS compliant construction supporting regulatory environmental requirements.

Typical Applications

• Industrial Control and Automation  Industrial-grade operation and a −40 °C to 100 °C temperature range make it well suited for control logic, motor drive interfaces, and programmable I/O in factory equipment.
• Embedded System Integration  50,000 logic elements and abundant on-chip RAM allow consolidation of multiple control functions and data buffering on a single FPGA for space- and cost-constrained designs.
• High-Density I/O Systems  With 360 I/O pins and a compact 484-BGA package, the device supports multi-channel sensor interfacing, parallel data acquisition, and dense peripheral connectivity.

Unique Advantages

• High Logic Capacity: 50,000 logic elements enable implementation of substantial custom logic and complex state machines without external glue logic.
• Large On-Chip Memory: 1,677,312 RAM bits provide significant local storage for buffering, packet processing, and temporary data structures, reducing external memory needs.
• Extensive I/O Availability: 360 I/O pins give design flexibility for interfacing multiple peripherals, sensors, and buses directly to the FPGA.
• Industrial Temperature Range: −40 °C to 100 °C operating range supports deployment in harsher environments where extended temperature tolerance is required.
• Compact, High-Pin-Count Package: 484-ball FBGA (23×23) offers a balance of high density and board-level integration for space-constrained applications.
• RoHS Compliant: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose 10M50DAF484I6G?

The 10M50DAF484I6G positions itself as a robust, high-capacity FPGA option for designs that require significant on-chip logic and memory combined with substantial I/O. Its industrial-grade temperature rating, defined supply voltage range, and compact 484-BGA package make it appropriate for embedded systems, industrial controllers, and high-density interface applications where reliability and integration matter.

For teams seeking a single-device solution that reduces external components while providing scalable logic and memory resources, this MAX® 10 FPGA delivers predictable electrical and thermal parameters to support long-term deployment and system-level consolidation.

Request a quote or submit an inquiry to receive pricing and availability details for the 10M50DAF484I6G. Our team can provide the information you need to move your design forward.