10M50DAF484C6GES

The 10M50DAF484C6GES is a MAX® 10 Field Programmable Gate Array (FPGA) IC in a 484-ball BGA package. It provides reconfigurable logic with a large logic element count, substantial on-chip RAM, and a high I/O count for commercial applications.

Designed for use where flexible, programmable logic and dense I/O are required, this device delivers a balance of integration and scalability with a 1.15–1.25 V supply range and a 0 °C to 85 °C commercial operating temperature.

Key Features

• Logic Capacity  50,000 logic elements organized across 3,125 LABs/CLBs, enabling complex programmable logic implementations.
• On‑Chip Memory  1,677,312 total RAM bits provide embedded storage for buffering, lookup tables, and state retention.
• I/O Resources  360 general-purpose I/O pins support a wide range of external interfaces and parallel connections.
• Power  Operates from a 1.15 V to 1.25 V supply range to match system power domains.
• Package and Mounting  484-FBGA (23 × 23) package, surface-mount mounting for compact board integration.
• Environmental and Grade  Commercial-grade device rated for 0 °C to 85 °C and compliant with RoHS requirements.

Typical Applications

• Consumer Electronics  Implement display controllers, I/O bridging, and custom logic functions where high logic density and abundant I/O are needed.
• Communications Equipment  Support protocol bridging, packet processing, or interface aggregation using the device's large logic and memory resources.
• Prototyping and Development  Use as a flexible platform for evaluating and iterating digital designs that require significant programmable logic and on-chip RAM.
• Instrumentation and Test Equipment  Integrate custom timing, control, and data handling functions leveraging the FPGA's I/O count and embedded memory.

Unique Advantages

• High Logic Density: 50,000 logic elements accommodate complex designs without external glue logic.
• Substantial On‑Chip RAM: 1,677,312 RAM bits reduce dependence on external memory for buffering and lookup tables.
• Extensive I/O: 360 I/O pins enable broad interfacing options and high pin-count connectivity.
• Compact Surface‑Mount BGA: 484-FBGA (23×23) package offers a space-efficient footprint for dense PCB layouts.
• Low-Voltage Operation: 1.15–1.25 V supply compatibility supports integration with low-voltage system rails.
• RoHS Compliant: Environmentally compliant manufacturing and materials.

Why Choose 10M50DAF484C6GES?

The 10M50DAF484C6GES positions itself as a commercially graded, reconfigurable solution offering significant logic capacity, abundant on-chip memory, and a high I/O count in a compact 484-BGA package. These attributes make it well suited to commercial designs that require dense programmable logic, flexible interfacing, and integrated RAM without expanding board footprint.

For design teams needing a scalable, reprogrammable platform with clear electrical and environmental specifications—1.15–1.25 V supply and 0 °C to 85 °C operating range—this MAX® 10 device provides a predictable foundation for development and deployment in commercial applications.

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